Company Filing History:
Years Active: 2014-2022
Title: The Innovative Mind of Dexian Liu: A Glimpse into His Patents and Career
Introduction: Dexian Liu, an inventive mind located in Jiangsu, China, stands out in the realm of electrical engineering with his noteworthy contributions to connector assembly technologies. Throughout his career, he has been granted three patents that showcase his innovative approaches and adept understanding of electrical systems.
Latest Patents: Liu's latest patents include groundbreaking designs for electrical connector assemblies. One of his significant inventions is the "Impedance Controlled Metallized Plastic Socket," which offers methods, systems, and apparatuses for connecting integrated circuit chips to printed circuit boards. This assembly features a socket body crafted from insulating material with multiple cavities, each intricately designed with conductive plating to form metal grounding shells.
Another vital patent is the "Impedance Controlled Test Socket," which emphasizes the design of a socket defining a signal cavity. This invention incorporates a signal contact probe, with mechanisms that include plungers and end insulation rings, ensuring stable impedance through the signal spring probe while restricting lateral movement.
Career Highlights: Dexian Liu has enriched his expertise through his involvement with prominent companies such as Smiths Interconnect and Interconnect Devices. His work has significantly influenced developments in the electrical connector field, leading to the optimization of device performance in various applications.
Collaborations: Throughout his career, Liu has collaborated with talented professionals like Jiachun Zhou and Khaled Elmadbouly. These partnerships have provided a platform for sharing knowledge and advancing innovations in connectivity technology.
Conclusion: Dexian Liu's journey as an inventor illustrates the essence of innovation in the electrical engineering sector. His patents not only reflect his technical skills and creativity but also contribute to the broader landscape of connector technology. With continued collaborations and advancements, Liu's future endeavors promise to yield even more groundbreaking inventions.