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Gyeonggi-do, South Korea

Siliconfile Technologies Inc.

USPTO Granted Patents = 49

EPO Patents = 4

Forward Citations = 320

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35 inventors (with patents filed for the assignee):

Do Young Lee (12 out of 27 patents)

Do-Young Lee (9 out of 9 patents)

Byoung-Su Lee (8 out of 8 patents)

4. Jun Ho Won (7 out of 8 patents)

5. Byoung Su Lee (6 out of 6 patents)

6. Heui-Gyun Ahn (5 out of 7 patents)

7. Heui Gyun Ahn (5 out of 6 patents)

8. In Gyun Jeon (4 out of 8 patents)

9. Se Jung Oh (4 out of 4 patents)

10. Sang Wook Ahn (3 out of 7 patents)

11. Huy Chan Jung (3 out of 6 patents)

12. Se-Jung Oh (3 out of 4 patents)

13. Jun-Ho Won (3 out of 3 patents)

14. In-Gyun Jeon (3 out of 3 patents)

15. Seung Hoon Sa (2 out of 2 patents)

Core Competencies:

Image Sensor

Backside Illumination

Stack Memory

CMOS Technology

Fingerprint Recognition

Optical Devices

3D Stacking

Dynamic Range

OLED Displays

Phototransistor

Biochip Technology

Proximity Sensing

49 patents: Sort by Forward Citations

1. 9934170 - Circuit for controlling access to memory using arbiter (2018-04-03),

2. 9553120 - Image sensor using backside illumination photodiode and method for manufacturing the same (2017-01-24),

3. 9552776 - Luminance compensation apparatus for organic light emitting diode panel (2017-01-24),

4. 9543348 - Backlight image sensor chip having improved chip driving performance (2017-01-10),

5. 9484377 - CMOS image sensor including infrared pixels having improved spectral properties, and method of manufacturing same (2016-11-01),

6. 9484375 - Image sensor with 3D stack structure (2016-11-01),

7. 9478464 - Method for manufacturing through-hole silicon via (2016-10-25),

8. 9406652 - Stack memory (2016-08-02),

9. 9377895 - Method for divided scanning of touch panel (2016-06-28),

10. 9337232 - Substrate stacked image sensor having a dual detection function (2016-05-10),

11. 9337228 - Stack chip package image sensor (2016-05-10),

12. 9324746 - Pixel circuit for global shutter of substrate stacked image sensor (2016-04-26),

13. 8993411 - Method for forming pad in wafer with three-dimensional stacking structure (2015-03-31),

14. 8906781 - Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same (2014-12-09),

15. 8854514 - Pixel array having wide dynamic range and good color reproduction and resolution and image sensor using the pixel array (2014-10-07),

Siliconfile Technologies Inc. is a leading provider of innovative technology solutions. With a focus on digital transformation, cloud computing, and artificial intelligence, we help businesses optimize their operations and improve their competitive advantage. Our team of experts delivers cutting-edge software products and services tailored to meet the specific needs of our clients. Through our commitment to excellence and customer satisfaction, we strive to empower companies with the tools and capabilities necessary to thrive in today's digital era.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

49 Patents

#25 in Gyeonggi-do

#312 in South Korea

#13,856 in the World

Gyeonggi-do, South Korea

Siliconfile Technologies Inc.

Forward Citations = 320

35 inventors:

Do Young Lee (12 out of 27 patents)

Do-Young Lee (9 out of 9 patents)

Byoung-Su Lee (8 out of 8 patents)

4. Jun Ho Won (7 out of 8 patents)

5. Byoung Su Lee (6 out of 6 patents)

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