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Seoul, South Korea

Siliconfile Technologies Inc.

USPTO Granted Patents = 49

% Expired Patents = 10.2

EPO Patents = 4

Forward Citations = 333

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35 inventors (with patents filed for the assignee):

Do Young Lee (13 out of 27 patents)

Do-Young Lee (9 out of 9 patents)

Byoung-Su Lee (8 out of 8 patents)

4. Jun Ho Won (7 out of 8 patents)

5. Byoung Su Lee (6 out of 6 patents)

6. Heui-Gyun Ahn (5 out of 7 patents)

7. Heui Gyun Ahn (5 out of 6 patents)

8. In Gyun Jeon (4 out of 8 patents)

9. Se Jung Oh (4 out of 4 patents)

10. Sang Wook Ahn (3 out of 7 patents)

11. Huy Chan Jung (3 out of 6 patents)

12. Se-Jung Oh (3 out of 4 patents)

13. Jun-Ho Won (3 out of 3 patents)

14. In-Gyun Jeon (3 out of 3 patents)

15. Seung Hoon Sa (2 out of 2 patents)

Core Competencies:

Backside Illumination

Pixel Array

Dynamic Range

Image Sensor

3D Stacking

Infrared Pixels

Proximity Sensor

Optical Devices

Phototransistor

AMOLED Display

Fingerprint Recognition

Biochip

49 patents: Sort by Forward Citations

1. 9934170 - Circuit for controlling access to memory using arbiter (2018-04-03),

2. 9553120 - Image sensor using backside illumination photodiode and method for manufacturing the same (2017-01-24),

3. 9552776 - Luminance compensation apparatus for organic light emitting diode panel (2017-01-24),

4. 9543348 - Backlight image sensor chip having improved chip driving performance (2017-01-10),

5. 9484377 - CMOS image sensor including infrared pixels having improved spectral properties, and method of manufacturing same (2016-11-01),

6. 9484375 - Image sensor with 3D stack structure (2016-11-01),

7. 9478464 - Method for manufacturing through-hole silicon via (2016-10-25),

8. 9406652 - Stack memory (2016-08-02),

9. 9377895 - Method for divided scanning of touch panel (2016-06-28),

10. 9337232 - Substrate stacked image sensor having a dual detection function (2016-05-10),

11. 9337228 - Stack chip package image sensor (2016-05-10),

12. 9337227 - Multi-substrate image sensor having a dual detection function (2016-05-10),

13. 9324746 - Pixel circuit for global shutter of substrate stacked image sensor (2016-04-26),

14. 8993411 - Method for forming pad in wafer with three-dimensional stacking structure (2015-03-31),

15. 8906781 - Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same (2014-12-09),

Company Overview

Siliconfile Technologies Inc., based in Seoul, South Korea, specializes in advanced imaging technologies and semiconductor solutions. The company focuses on the development and manufacturing of image sensors, particularly those utilizing backside illumination and CMOS technology. Siliconfile is also engaged in innovations related to stack memory, fingerprint recognition, and optical devices, emphasizing high dynamic range and 3D stacking techniques. Their expertise positions them at the forefront of the evolving landscape of imaging and sensing technologies.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

49 Patents

#125 in Seoul

#326 in South Korea

#14,293 in the World

Seoul, South Korea

Siliconfile Technologies Inc.

Forward Citations = 333

35 inventors:

Do Young Lee (13 out of 27 patents)

Do-Young Lee (9 out of 9 patents)

Byoung-Su Lee (8 out of 8 patents)

4. Jun Ho Won (7 out of 8 patents)

5. Byoung Su Lee (6 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Siliconfile Technologies Inc.. Retrieved from https://idiyas.com/company/siliconfile-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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