The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Nov. 13, 2013
Applicant:
Siliconfile Technologies Inc., Seongnam-si, Gyeonggi-do, KR;
Inventor:
In Gyun Jeon, Seongnam-si, KR;
Assignee:
Siliconfile Technologies Inc., Seongnam-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 25/00 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/481 (2013.01); H01L 24/80 (2013.01); H01L 24/92 (2013.01); H01L 21/76802 (2013.01); H01L 27/14634 (2013.01); H01L 27/1469 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/821 (2013.01); H01L 2224/08147 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/82 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06505 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/9212 (2013.01); H01L 24/07 (2013.01); H01L 2224/82031 (2013.01);
Abstract
The present invention relates to a method for electrically connecting wafers, which physically bonds two wafers through an oxide-to-oxide bonding method and then electrically connects the two wafers through a butting contact structure. The wafers are physically bonded to each other through a relatively simple method, and then electrically connected to through TSVs or butting contact holes. Therefore, since the fabrication process may be simplified, a process error may be reduced, and the product yield may be improved.