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For the Inventor, By the Inventor

Hsinchu, Taiwan

Silicon Base Development Inc.


USPTO Granted Patents = 4

% Expired Patents = 75.0

Forward Citations = 25

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7 inventors (with patents filed for the assignee):

goldMedal Chih-Ming Chen (4 out of 213 patents)

silverMedal Deng-Huei Hwang (3 out of 3 patents)

bronzeMedal Ching-Chi Cheng (3 out of 3 patents)

4.  An-Nong Wen (2 out of 2 patents)

5.  Ming-Sen Hsu (1 out of 7 patents)

6.  Charng-Shyang Jong (1 out of 7 patents)

7.  Chin-Fu Ku (1 out of 1 patent)


4 patents:

1. 8513790 - Package-base structure of luminescent diode (2013-08-20),
2. 8097476 - Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package (2012-01-17),
3. 8048694 - Package base structure and associated manufacturing method (2011-11-01),
4. 7701050 - Side-view optical diode package and fabricating process thereof (2010-04-20),
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USPTO Data Jan 1 1976 - Oct 6 2026

4 Patents

#396 in Hsinchu

#2,733 in Taiwan

Hsinchu, TW
Hsinchu, Taiwan

Silicon Base Development Inc.

Forward Citations = 25

7 inventors:

goldMedal Chih-Ming Chen (4 out of 213 patents)

silverMedal Deng-Huei Hwang (3 out of 3 patents)

bronzeMedal Ching-Chi Cheng (3 out of 3 patents)

4.  An-Nong Wen (2 out of 2 patents)

5.  Ming-Sen Hsu (1 out of 7 patents)

Please report any incorrect information to [email protected]
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