For the Inventor, By the Inventor

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Hsinchu, Taiwan

Silicon Base Development Inc.

USPTO Granted Patents = 4

Forward Citations = 25

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7 inventors (with patents filed for the assignee):

Chih-Ming Chen (4 out of 203 patents)

Deng-Huei Hwang (3 out of 3 patents)

Ching-Chi Cheng (3 out of 3 patents)

4. An-Nong Wen (2 out of 2 patents)

5. Ming-Sen Hsu (1 out of 7 patents)

6. Charng-Shyang Jong (1 out of 7 patents)

7. Chin-Fu Ku (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 8513790 - Package-base structure of luminescent diode (2013-08-20),

2. 8097476 - Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package (2012-01-17),

3. 8048694 - Package base structure and associated manufacturing method (2011-11-01),

4. 7701050 - Side-view optical diode package and fabricating process thereof (2010-04-20),

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USPTO Data Jan 1 1976 - Dec 23 2025

4 Patents

#232 in Hsinchu

#2,619 in Taiwan

Hsinchu, Taiwan

Silicon Base Development Inc.

Forward Citations = 25

7 inventors:

Chih-Ming Chen (4 out of 203 patents)

Deng-Huei Hwang (3 out of 3 patents)

Ching-Chi Cheng (3 out of 3 patents)

4. An-Nong Wen (2 out of 2 patents)

5. Ming-Sen Hsu (1 out of 7 patents)

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