The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2010
Filed:
Dec. 12, 2007
Chih-ming Chen, Taoyuan, TW;
Deng-huei Hwang, Taipei, TW;
Ching-chi Cheng, Hsinchu, TW;
An-nong Wen, Hsinchu, TW;
Chih-Ming Chen, Taoyuan, TW;
Deng-Huei Hwang, Taipei, TW;
Ching-Chi Cheng, Hsinchu, TW;
An-Nong Wen, Hsinchu, TW;
Silicon Base Development Inc., Hsinchu, TW;
Abstract
A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.