The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
May. 16, 2007
Charng-shyang Jong, Hsinchu, TW;
Ming-sen Hsu, Sinhua Township, Tainan County, TW;
Chin-fu Ku, Shanhua Township, Tainan County, TW;
Chih-ming Chen, Jhubei, TW;
Deng-huei Hwang, Danshuei Township, Taipei County, TW;
Charng-Shyang Jong, Hsinchu, TW;
Ming-Sen Hsu, Sinhua Township, Tainan County, TW;
Chin-Fu Ku, Shanhua Township, Tainan County, TW;
Chih-Ming Chen, Jhubei, TW;
Deng-Huei Hwang, Danshuei Township, Taipei County, TW;
Epileds Technologies Inc., Tainan County, TW;
Silicon Base Developmen Inc., Hsinchu, TW;
Abstract
This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.