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Forward Citations = 9

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13 inventors (with patents filed for the assignee):

Kaoru Hishiki (3 out of 15 patents)

Ryohei Yamashita (1 out of 44 patents)

Shimpei Sasaoka (1 out of 42 patents)

4. Yoshio Ichihara (1 out of 8 patents)

5. Hiroki Nakayama (1 out of 10 patents)

6. Ichinori Iidani (1 out of 5 patents)

7. Jun Fukuzaki (1 out of 2 patents)

8. Shigeru Hosomomi (1 out of 3 patents)

9. Shunichi Kidoguchi (1 out of 1 patent)

10. Yasuo Toyoshi (1 out of 1 patent)

11. Ryouichi Yoshimoto (1 out of 1 patent)

12. Katsuyuki Doumae (1 out of 1 patent)

13. Yoichiro Hamada (1 out of 3 patents)

7 patents: Sort by Forward Citations

1. 10181436 - Lead frame and method of manufacturing the same (2019-01-15),

2. 9870930 - Method for producing substrate for mounting semiconductor element (2018-01-16),

3. 9735106 - Semiconductor lead frame, semiconductor package, and manufacturing method thereof (2017-08-15),

4. 9735096 - Lead frame and method for manufacturing the same (2017-08-15),

5. 9691689 - Lead frame for mounting semiconductor element and method for manufacturing the same (2017-06-27),

6. 9583422 - Lead frame (2017-02-28),

7. 9054116 - Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package (2015-06-09),

SH Materials Co., Ltd. is a leading manufacturer and distributor of high-quality construction materials. With a strong commitment to sustainability and innovation, our company offers a wide range of products including cement, steel, and aggregates. We strive to provide the best solutions to meet the needs of our customers in the construction industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

7 Patents

#2,034 in Tokyo

#5,310 in Japan

Tokyo, Japan

Sh Materials Co., Ltd.