The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Jul. 30, 2015
Applicant:
Sh Materials Co., Ltd., Tokyo, JP;
Inventors:
Kaoru Hishiki, Kagoshima, JP;
Yasuo Toyoshi, Kagoshima, JP;
Assignee:
SH MATERIALS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 21/4828 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 33/62 (2013.01);
Abstract
A metal plateto be a lead frame has a plating with Sn or Zn or a plating with various alloys containing these metals only on the side faces and half-etched faces, and a noble metal plating layer formed on the front surface as a surface on which a semiconductor device is to be mounted.