For the Inventor, By the Inventor

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Wakefield, MA, United States of America

Semigear, Inc.

USPTO Granted Patents = 19

Forward Citations = 772

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16 inventors (with patents filed for the assignee):

Jian Zhang (15 out of 32 patents)

Chunghsin Lee (6 out of 26 patents)

Joshua Pinnolis (5 out of 5 patents)

4. Shijian Luo (5 out of 6 patents)

5. Darren M Simonelli (2 out of 5 patents)

6. David A Wassen (2 out of 2 patents)

7. Suncheol Lee (1 out of 1 patent)

8. Jaeho Park (1 out of 6 patents)

9. Yonghoe Heo (1 out of 1 patent)

10. Donghee Lee (1 out of 1 patent)

11. Seockhwi Lee (1 out of 1 patent)

12. Wonchang Choi (1 out of 1 patent)

13. Keith D Mullins (1 out of 1 patent)

14. Jonghoon Kim (1 out of 1 patent)

15. Jihoon Kim (1 out of 1 patent)

19 patents: Sort by Forward Citations

1. 11456192 - Apparatus and method for cooling substrate (2022-09-27),

2. 11315807 - Substrate pressing module, substrate pressing method, substrate treating apparatus including the substrate treating module, and the substrate treating method (2022-04-26),

3. 10937757 - Device packaging facility and method, and device processing apparatus utilizing DEHT (2021-03-02),

4. 10861735 - Substrate support unit (2020-12-08),

5. 10790179 - Alignment apparatus (2020-09-29),

6. 10283481 - Device packaging facility and method, and device processing apparatus utilizing DEHT (2019-05-07),

7. 9824998 - Device packaging facility and method, and device processing apparatus utilizing DEHT (2017-11-21),

8. 9741683 - Device packaging facility and method, and device processing apparatus utilizing phthalate (2017-08-22),

9. 9629258 - Reflow treating unit and substrate treating apparatus (2017-04-18),

10. 9572266 - Reflow treating unit and substrate treating apparatus (2017-02-14),

11. 9472531 - Device packaging facility and method, and device processing apparatus utilizing phthalate (2016-10-18),

12. 9226407 - Reflow treating unit and substrate treating apparatus (2015-12-29),

13. 8524593 - Arrangement for solder bump formation on wafers (2013-09-03),

14. 8274161 - Flux-free chip to substrate joint serial linear thermal processor arrangement (2012-09-25),

15. 8252678 - Flux-free chip to wafer joint serial thermal processor arrangement (2012-08-28),

SEMIgear, Inc. is a leading manufacturer of advanced semiconductor equipment and technology solutions. With a strong focus on innovation and quality, we provide cutting-edge equipment for the semiconductor industry. Our products range from wafer handling systems to precision metrology tools, enabling semiconductor manufacturers to achieve high throughput and accuracy in their production processes. Our team of experienced engineers and technicians continuously strive to develop solutions that meet the evolving needs of the semiconductor industry. Visit our website to learn more about our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

19 Patents

#11 in Wakefield, MA

#1,004 in Massachusetts

#16,593 in US

#31,684 in the World

Wakefield, MA, United States of America

Semigear, Inc.

Forward Citations = 772

16 inventors:

Jian Zhang (15 out of 32 patents)

Chunghsin Lee (6 out of 26 patents)

Joshua Pinnolis (5 out of 5 patents)

4. Shijian Luo (5 out of 6 patents)

5. Darren M Simonelli (2 out of 5 patents)

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