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Wakefield, MA, United States of America

Semigear, Inc.

USPTO Granted Patents = 19

% Expired Patents = 31.6

Forward Citations = 799

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16 inventors (with patents filed for the assignee):

Jian Zhang (15 out of 32 patents)

Chunghsin Lee (6 out of 26 patents)

Joshua Pinnolis (5 out of 5 patents)

4. Shijian Luo (5 out of 6 patents)

5. Darren M Simonelli (2 out of 5 patents)

6. David A Wassen (2 out of 2 patents)

7. Suncheol Lee (1 out of 1 patent)

8. Jaeho Park (1 out of 6 patents)

9. Yonghoe Heo (1 out of 1 patent)

10. Donghee Lee (1 out of 1 patent)

11. Seockhwi Lee (1 out of 1 patent)

12. Wonchang Choi (1 out of 1 patent)

13. Keith D Mullins (1 out of 1 patent)

14. Jonghoon Kim (1 out of 1 patent)

15. Jihoon Kim (1 out of 1 patent)

19 patents: Sort by Forward Citations

1. 11456192 - Apparatus and method for cooling substrate (2022-09-27),

2. 11315807 - Substrate pressing module, substrate pressing method, substrate treating apparatus including the substrate treating module, and the substrate treating method (2022-04-26),

3. 10937757 - Device packaging facility and method, and device processing apparatus utilizing DEHT (2021-03-02),

4. 10861735 - Substrate support unit (2020-12-08),

5. 10790179 - Alignment apparatus (2020-09-29),

6. 10283481 - Device packaging facility and method, and device processing apparatus utilizing DEHT (2019-05-07),

7. 9824998 - Device packaging facility and method, and device processing apparatus utilizing DEHT (2017-11-21),

8. 9741683 - Device packaging facility and method, and device processing apparatus utilizing phthalate (2017-08-22),

9. 9629258 - Reflow treating unit and substrate treating apparatus (2017-04-18),

10. 9572266 - Reflow treating unit and substrate treating apparatus (2017-02-14),

11. 9472531 - Device packaging facility and method, and device processing apparatus utilizing phthalate (2016-10-18),

12. 9226407 - Reflow treating unit and substrate treating apparatus (2015-12-29),

13. 8524593 - Arrangement for solder bump formation on wafers (2013-09-03),

14. 8274161 - Flux-free chip to substrate joint serial linear thermal processor arrangement (2012-09-25),

15. 8252678 - Flux-free chip to wafer joint serial thermal processor arrangement (2012-08-28),

Company Overview

Semigear, Inc. is a technology company based in Wakefield, MA, specializing in advanced semiconductor manufacturing solutions. The organization focuses on developing innovative equipment and processes that enhance the efficiency and precision of semiconductor fabrication. With a commitment to research and development, Semigear aims to address the evolving needs of the semiconductor industry, providing tools that support the production of high-performance electronic components. Its expertise contributes to advancements in various sectors, including consumer electronics and telecommunications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

19 Patents

#10 in Wakefield, MA

#1,049 in Massachusetts

#17,150 in US

#32,693 in the World

Wakefield, MA, United States of America

Semigear, Inc.

Forward Citations = 799

16 inventors:

Jian Zhang (15 out of 32 patents)

Chunghsin Lee (6 out of 26 patents)

Joshua Pinnolis (5 out of 5 patents)

4. Shijian Luo (5 out of 6 patents)

5. Darren M Simonelli (2 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Semigear, Inc.. Retrieved from https://idiyas.com/company/semigear

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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