CIPO Patents = 1

EPO Patents = 2

Trademarks = 6

Forward Citations = 45

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7 inventors (with patents filed for the assignee):

Shigeru Tsutsumi (3 out of 14 patents)

Hajime Sakano (2 out of 2 patents)

Tsutomu Saito (2 out of 2 patents)

4. Yoshiaki Tanaka (1 out of 146 patents)

5. Masaaki Yoshida (1 out of 1 patent)

6. Koichi Uehara (1 out of 1 patent)

7. Izumi Kato (1 out of 2 patents)

8. Koichi Uehara (0 patent)

6 patents: Sort by Forward Citations

1. 11701799 - Cleaning agent composition and molding raw material (2023-07-18),

2. 11633880 - Cleaning agent composition and molding raw material (2023-04-25),

3. 7217384 - Device and method for runner-less molding of thermosetting resin and rubber (2007-05-15),

4. 5248460 - Pressure-holding chamber type injection molding process and apparatus (1993-09-28),

5. 5246660 - Process and apparatus for injection molding with melt filtration and (1993-09-21),

6. 5219512 - Improved pressure-holding chamber type injection molding process and (1993-06-15),

Seiki Corporation is a global leader in the development and manufacturing of precision electronics components. With a focus on quality and innovation, Seiki offers a wide range of products including sensors, connectors, and switches for various industries such as automotive, aerospace, and telecommunications.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

6 Patents

#1 in Yonezawa-shi Yamagata

#5,842 in Japan

Yonezawa-shi Yamagata, Japan

Seiki Corporation

Forward Citations = 45

7 inventors:

Shigeru Tsutsumi (3 out of 14 patents)

Hajime Sakano (2 out of 2 patents)

Tsutomu Saito (2 out of 2 patents)

4. Yoshiaki Tanaka (1 out of 146 patents)

5. Masaaki Yoshida (1 out of 1 patent)

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1 patent (CIPO):

Please report any incorrect information to support@idiyas.com

2 patents (EPO):

Please report any incorrect information to support@idiyas.com