The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2007
Filed:
Oct. 01, 2002
Yoshiaki Tanaka, Yonezawa, JP;
Masaaki Yoshida, Yonezawa, JP;
Yoshiaki Tanaka, Yonezawa, JP;
Masaaki Yoshida, Yonezawa, JP;
Seiki Corporation, Yonezawa-shi, Yamagata, JP;
Abstract
A runner-less molding device for thermosetting resins and rubbers, characterized by a movable runner bush (), through which an uncured or unvulcanized fluid material kept at a low temperature supplied from a pouring nozzle () can flow, is slidably arranged in a temperature controlling bush () communicating with a gate () of a cavity (); an insulation space (A) is formed by moving the movable runner bush () apart from the gate () during heating; a valve pin () is movably inserted into said movable runner bush (); and the valve pin () is arranged so as to open and close the gate () in accordance with a pouring operation of the fluid material. A runner part of the movable runner bush containing molding material is constituted so as to move forward/backward relative to the cavity for preventing heat from conducting from the cavity, which is kept at a molding temperature, to the runner positioned apart from the gate for a long time, so that material loss generated in a sprue runner is reduced to almost null in order to reduce fabricating costs after molding and amount of wastes generated during after treatments. Thus, the improved molding device for the thermosetting resin and the rubber is obtained, and burdens on the global environment are alleviated.