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Irvine, CA, United States of America

Packard Hughes Interconnect Company

Calculating rank

USPTO Granted Patents = 37

Forward Citations = 631

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29 inventors (with patents filed for the assignee):

Bao Le (8 out of 8 patents)

Haim Feigenbaum (7 out of 32 patents)

Chris M Schreiber (7 out of 13 patents)

4. William R Crumly (7 out of 31 patents)

5. James Sungioun Lee (7 out of 7 patents)

6. John Steven Szalay (6 out of 13 patents)

7. Eric Dean Jensen (4 out of 13 patents)

8. Edward Rudoy (3 out of 27 patents)

9. Mehrad Ghara (2 out of 2 patents)

10. David Bryan Swarbrick (2 out of 5 patents)

11. Terry Shing Wang (2 out of 6 patents)

12. Randy Lee Thomas (2 out of 2 patents)

13. Phillip D Winters (2 out of 2 patents)

14. Ronald E Gabrisko, Jr (2 out of 3 patents)

15. Robert Earl Daugherty, Jr (1 out of 3 patents)

Core Competencies:

Integrated Circuit

Electrical Connector

Flexible Circuit

Optical Fiber

Solderless Connector

Wafer Scale

Testing Device

Interconnection System

Contact Pad

Mandrel

Switch Mechanism

Bumps

37 patents: Sort by Forward Citations

1. 6313402 - Stress relief bend useful in an integrated circuit redistribution patch (2001-11-06),

2. 6303988 - Wafer scale burn-in socket (2001-10-16),

3. 6166333 - Bumps with plural under-bump dielectric layers (2000-12-26),

4. 6152608 - Snap lock connector for optical fiber systems (2000-11-28),

5. 6149471 - Arrowhead retention feature for a terminal pin (2000-11-21),

6. 6085414 - Method of making a flexible circuit with raised features protruding from (2000-07-11),

7. 6033234 - Printed circuit board to flexible printed circuit connection system (2000-03-07),

8. 6007669 - Layer to layer interconnect (1999-12-28),

9. 6007351 - Bussplate (1999-12-28),

10. 5990695 - Membrane test probe (1999-11-23),

11. 5986873 - Creating surface topography on an electrostatic chuck with a mandrel (1999-11-16),

12. 5971773 - Solderless electrical connector (1999-10-26),

13. 5971772 - Low profile clamping mechanism for connecting a printed circuit board to (1999-10-26),

14. 5946555 - Wafer level decal for minimal packaging of chips (1999-08-31),

15. 5934926 - Electrical connector system with pre-staged feature (1999-08-10),

Company Overview

Packard Hughes Interconnect Company, based in Irvine, California, specializes in the design and manufacture of advanced interconnect solutions. The company focuses on high-performance connectors and cable assemblies that cater to various industries, including aerospace, defense, and telecommunications. With a commitment to innovation, Packard Hughes integrates cutting-edge technology into its products, ensuring reliability and efficiency in demanding environments. Their expertise in interconnect technology positions them as a key player in enhancing connectivity solutions across critical sectors.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

37 Patents

#95 in Irvine, CA

#2,192 in California

#9,276 in US

#18,312 in the World

Irvine, CA, United States of America

Packard Hughes Interconnect Company

Forward Citations = 631

29 inventors:

Bao Le (8 out of 8 patents)

Haim Feigenbaum (7 out of 32 patents)

Chris M Schreiber (7 out of 13 patents)

4. William R Crumly (7 out of 31 patents)

5. James Sungioun Lee (7 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Packard Hughes Interconnect Company. Retrieved from https://idiyas.com/company/packard-hughes-interconnect-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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