For the Inventor, By the Inventor

Enter assignee name

Irvine, CA, United States of America

Packard Hughes Interconnect Company

USPTO Granted Patents = 37

Forward Citations = 623

Loading Chart...

Loading Chart...

29 inventors (with patents filed for the assignee):

Bao Le (8 out of 8 patents)

Haim Feigenbaum (7 out of 32 patents)

Chris M Schreiber (7 out of 13 patents)

4. William R Crumly (7 out of 31 patents)

5. James Sungioun Lee (7 out of 7 patents)

6. John Steven Szalay (6 out of 13 patents)

7. Eric Dean Jensen (4 out of 13 patents)

8. Edward Rudoy (3 out of 27 patents)

9. Mehrad Ghara (2 out of 2 patents)

10. David Bryan Swarbrick (2 out of 5 patents)

11. Terry Shing Wang (2 out of 6 patents)

12. Randy Lee Thomas (2 out of 2 patents)

13. Phillip D Winters (2 out of 2 patents)

14. Ronald E Gabrisko, Jr (2 out of 3 patents)

15. Robert Earl Daugherty, Jr (1 out of 3 patents)

37 patents: Sort by Forward Citations

1. 6313402 - Stress relief bend useful in an integrated circuit redistribution patch (2001-11-06),

2. 6303988 - Wafer scale burn-in socket (2001-10-16),

3. 6166333 - Bumps with plural under-bump dielectric layers (2000-12-26),

4. 6152608 - Snap lock connector for optical fiber systems (2000-11-28),

5. 6149471 - Arrowhead retention feature for a terminal pin (2000-11-21),

6. 6085414 - Method of making a flexible circuit with raised features protruding from (2000-07-11),

7. 6033234 - Printed circuit board to flexible printed circuit connection system (2000-03-07),

8. 6007669 - Layer to layer interconnect (1999-12-28),

9. 6007351 - Bussplate (1999-12-28),

10. 5990695 - Membrane test probe (1999-11-23),

11. 5986873 - Creating surface topography on an electrostatic chuck with a mandrel (1999-11-16),

12. 5971773 - Solderless electrical connector (1999-10-26),

13. 5971772 - Low profile clamping mechanism for connecting a printed circuit board to (1999-10-26),

14. 5946555 - Wafer level decal for minimal packaging of chips (1999-08-31),

15. 5934926 - Electrical connector system with pre-staged feature (1999-08-10),

Packard Hughes Interconnect Company designs and manufactures high-performance interconnect solutions for various industries. With over 50 years of experience, our company is known for providing reliable and innovative products that meet the demanding requirements of our customers. We offer a wide range of connectors, cables, and systems for applications in aerospace, defense, telecommunications, and industrial sectors. Our commitment to quality, continuous improvement, and customer satisfaction has established us as a trusted partner in the interconnect industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

37 Patents

#92 in Irvine, CA

#2,128 in California

#8,948 in US

#17,724 in the World

Irvine, CA, United States of America

Packard Hughes Interconnect Company

Forward Citations = 623

29 inventors:

Bao Le (8 out of 8 patents)

Haim Feigenbaum (7 out of 32 patents)

Chris M Schreiber (7 out of 13 patents)

4. William R Crumly (7 out of 31 patents)

5. James Sungioun Lee (7 out of 7 patents)

Please report any incorrect information to support@idiyas.com

Loading…