Forward Citations = 84

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6 inventors (with patents filed for the assignee):

Arthur Keigler (6 out of 37 patents)

Zhenqiu Liu (5 out of 9 patents)

John Harrell (5 out of 8 patents)

4. Qunwei Wu (5 out of 12 patents)

5. David Felsenthal (1 out of 7 patents)

6. Martin P Klein (1 out of 4 patents)

6 patents: Sort by Forward Citations

1. 8168057 - Balancing pressure to improve a fluid seal (2012-05-01),

2. 8038856 - Method and apparatus for fluid processing a workpiece (2011-10-18),

3. 7727366 - Balancing pressure to improve a fluid seal (2010-06-01),

4. 7722747 - Method and apparatus for fluid processing a workpiece (2010-05-25),

5. 7445697 - Method and apparatus for fluid processing a workpiece (2008-11-04),

6. 7100954 - Ultra-thin wafer handling system (2006-09-05),

Nexx Systems, Inc. is a leading provider of advanced wafer-level packaging equipment and solutions for the semiconductor industry. With a focus on innovation and cutting-edge technology, Nexx Systems helps customers achieve higher productivity and performance in their manufacturing processes. Their extensive product portfolio includes solutions for flip chip bonding, wafer level fan-out, and advanced packaging applications.

This text is generated by artificial intelligence and may not be accurate.