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14 inventors (with patents filed for the assignee):

Yasuo Ohno (4 out of 4 patents)

Minoru Yamamoto (2 out of 7 patents)

Hiroaki Tamemoto (2 out of 17 patents)

4. Hiroko Itoh (2 out of 2 patents)

5. Ryota Taoka (2 out of 3 patents)

6. Hiroto Tamaki (1 out of 89 patents)

7. Masakazu Sakamoto (1 out of 12 patents)

8. Kock Khuen Seet (1 out of 1 patent)

9. Masayuki Hayashida (1 out of 1 patent)

10. Richard A Boulais (1 out of 4 patents)

11. Yuichi Asakawa (1 out of 1 patent)

12. Yasuyuki Tsuboi (1 out of 1 patent)

13. Ryota Takao (1 out of 1 patent)

14. Hiroshi Yaguchi (1 out of 1 patent)

8 patents: Sort by Forward Citations

1. 12319007 - Method for producing resin part (2025-06-03),

2. 11945173 - Resin member machining method, resin member machining apparatus, and resin component manufacturing method (2024-04-02),

3. 11469682 - Semiconductor device (2022-10-11),

4. 11338393 - Manufacturing method of processed resin substrate and laser processing apparatus (2022-05-24),

5. 11196302 - Resonance apparatus, power transmission apparatus, and power transmission method (2021-12-07),

6. 11171572 - Microwave-rectifying circuit (2021-11-09),

7. 11095339 - Resonance apparatus, power transmission apparatus, and power transmission method to improve noncontact power transmission (2021-08-17),

8. 4203665 - Aerial surveying method to determine ground contours (1980-05-20),

Laser Systems Inc. is a leading provider of cutting-edge laser technology solutions for a wide range of industries. With over 20 years of experience, we specialize in designing and manufacturing high-quality laser systems that are reliable and efficient. Our innovative products are known for their precision, speed, and accuracy, making them ideal for applications such as industrial manufacturing, medical devices, and scientific research. Visit our website to learn more about how our laser systems can enhance your operations.

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USPTO Data Jan 1 1976 - Dec 2 2025

8 Patents

#11 in Hokkaido

#4,914 in Japan

Hokkaido, Japan

Laser Systems Inc.