The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Oct. 28, 2016
Applicants:
Laser Systems Inc., Hokkaido, JP;
Nichia Corporation, Tokushima, JP;
Inventors:
Kock Khuen Seet, Hokkaido, JP;
Masayuki Hayashida, Tokushima, JP;
Masakazu Sakamoto, Tokushima, JP;
Hiroto Tamaki, Anan, JP;
Assignees:
LASER SYSTEMS INC., Hokkaido, JP;
NICHIA CORPORATION, Tokushima, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/382 (2014.01); H05K 3/00 (2006.01); B23K 26/0622 (2014.01); B23K 26/082 (2014.01); B23K 103/00 (2006.01); B23K 26/18 (2006.01); B23K 26/402 (2014.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
B23K 26/382 (2015.10); B23K 26/0622 (2015.10); B23K 26/082 (2015.10); B23K 26/18 (2013.01); B23K 26/402 (2013.01); H05K 3/0035 (2013.01); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/42 (2018.08); H05K 2201/09127 (2013.01); H05K 2203/0554 (2013.01);
Abstract
A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.