logo

For the Inventor, By the Inventor

Gunma, Japan

Hitachi High-Tech Instruments Company, Ltd.


USPTO Granted Patents = 43

% Expired Patents = 14.0


Forward Citations = 124

Loading Chart...
Loading Chart...

77 inventors (with patents filed for the assignee):

goldMedal Kazuyoshi Oyama (10 out of 15 patents)

silverMedal Hiroshi Maki (5 out of 32 patents)

bronzeMedal Akihiro Kawai (5 out of 6 patents)

4.  Makio Kameda (5 out of 5 patents)

5.  Hideaki Fukushima (5 out of 6 patents)

6.  Tsutomu Yanagida (5 out of 5 patents)

7.  Akira Aoki (4 out of 14 patents)

8.  Manabu Okamoto (4 out of 7 patents)

9.  Akio Watanabe (4 out of 5 patents)

10.  Yoshinao Usui (4 out of 8 patents)

11.  Kazuyoshi Ieizumi (4 out of 5 patents)

12.  Koichi Izuhara (4 out of 4 patents)

13.  Katsuyuki Seto (4 out of 4 patents)

14.  Hisayoshi Kashitani (4 out of 5 patents)

15.  Yoshiharu Fukushima (4 out of 4 patents)


Core Competencies:
Die Bonder
Bonding Method
Electronic Component
Mounting Apparatus
Component Feeder
Motor Control
Frame Feeding System
Foreign Substance Removal
Tool Management
Pickup Device
Component Placement
Board Positioning

43 patents:

1. 8991681 - Die bonder and bonding method (2015-03-31),
2. 8965572 - Frame feeding system and frame feeding method (2015-02-24),
3. 8783319 - Foreign substance removing device and die bonder equipped with the same (2014-07-22),
4. 8727202 - Die bonder and bonding method (2014-05-20),
5. 8593261 - Tool management method of die bonder and die bonder (2013-11-26),
6. 8565238 - Industrial network system (2013-10-22),
7. 8561664 - Die bonder, pickup method, and pickup device (2013-10-22),
8. 8540001 - Die bonder and semiconductor manufacturing method (2013-09-24),
9. 8460491 - Die bonder and bonding method (2013-06-11),
10. 8456126 - Motor control system and motor control method (2013-06-04),
11. 8353424 - Component feeder (2013-01-15),
12. 8340803 - Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method (2012-12-25),
13. 8336195 - Electronic component mounting apparatus (2012-12-25),
14. 8266787 - Electronic component mounting apparatus (2012-09-18),
15. 8186047 - Method of mounting electronic component (2012-05-29),
Company Overview
Hitachi High-Tech Instruments Company, Ltd., based in Gunma, Japan, specializes in advanced manufacturing solutions and technologies. The company focuses on die bonding, bonding methods, and innovative systems for electronic component mounting. Its expertise extends to frame feeding systems, foreign substance removal, and motor control systems, catering to the evolving needs of the industrial sector. Hitachi High-Tech is committed to enhancing production efficiency and reliability through cutting-edge technology and integrated industrial network systems.
Profile summary synthesized from public USPTO records and patent filings.

logo

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

Hitachi High-Tech Instruments Company, Ltd. USPTO Patent Assignee Logo
43 Patents

#7 in Gunma

#1,886 in Japan

#16,040 in the World

Gunma, JP
Gunma, Japan

Hitachi High-Tech Instruments Company, Ltd.

Forward Citations = 124

77 inventors:

goldMedal Kazuyoshi Oyama (10 out of 15 patents)

silverMedal Hiroshi Maki (5 out of 32 patents)

bronzeMedal Akihiro Kawai (5 out of 6 patents)

4.  Makio Kameda (5 out of 5 patents)

5.  Hideaki Fukushima (5 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hitachi High-Tech Instruments Company, Ltd.. Retrieved from https://idiyas.com/company/hitachi-high-tech-instruments-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…