The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Mar. 06, 2012
Hiroshi Maki, Kumagaya, JP;
Masayuki Mochizuki, Kumagaya, JP;
Yukio Tani, Kumagaya, JP;
Takehito Mochizuki, Kumagaya, JP;
Hiroshi Maki, Kumagaya, JP;
Masayuki Mochizuki, Kumagaya, JP;
Yukio Tani, Kumagaya, JP;
Takehito Mochizuki, Kumagaya, JP;
Hitachi High-Tech Instuments Co., Ltd., Kumagaya-shi, JP;
Abstract
A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.