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Highcon Systems Ltd.

USPTO Granted Patents = 20

EPO Patents = 6

Trademarks = 1

Forward Citations = 19

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21 inventors (with patents filed for the assignee):

Michael Zimmer (7 out of 8 patents)

Claudio Rottman (5 out of 19 patents)

David Ben-David (4 out of 9 patents)

4. Michael Karp (4 out of 10 patents)

5. Kostantin Spiryagin (4 out of 4 patents)

6. Aviv Ratzman (4 out of 5 patents)

7. David Idan (4 out of 5 patents)

8. Lior Dahan (4 out of 5 patents)

9. Ron Or (2 out of 2 patents)

10. Natalia Zlotnikov (2 out of 2 patents)

11. Eli Ireni (2 out of 3 patents)

12. Yaki Stern (2 out of 11 patents)

13. Rainer Buschulte (2 out of 12 patents)

14. Lior Sirkis (1 out of 1 patent)

15. Yaron Smirnov (1 out of 1 patent)

20 patents: Sort by Forward Citations

1. 12552125 - Method and system for cardboard pretreatment (2026-02-17),

2. 12202972 - Method and system for creating co-layer surface adhesive rule (2025-01-21),

3. 12194509 - System and method for cleaning a laser cut substrate (2025-01-14),

4. 11858776 - Sheet conveying apparatus (2024-01-02),

5. 11780108 - Method and apparatus for substrate stripping (2023-10-10),

6. 11667099 - System for creating a relief pattern on a substrate (2023-06-06),

7. 11135803 - System for impressing a relief pattern on a substrate (2021-10-05),

8. 11130307 - Polymeric rule die, and formulations therefor (2021-09-28),

9. 11059253 - Method and system for cardboard pretreatment (2021-07-13),

10. 10625485 - Polymeric rule die, and formulations therefor (2020-04-21),

11. 10556415 - Method and apparatus for building a 3D object from layers of pre-stripped substrate (2020-02-11),

12. 10427248 - Cardboard-handling system and method (2019-10-01),

13. 9545638 - Method and system for a multiple-orifice nozzle (2017-01-17),

14. 9492984 - Systems and methods for treating and handling cardboard sheets (2016-11-15),

15. 9436012 - Method and apparatus for laser cutting (2016-09-06),

Highcon Systems Ltd. is a technology company based in Yavne, Israel, specializing in digital cutting and creasing solutions for the packaging industry. The company focuses on developing innovative machinery that enhances efficiency and flexibility in the production of packaging materials. Highcon's technology integrates advanced software and hardware to streamline workflows, enabling manufacturers to respond swiftly to market demands while reducing waste and operational costs. Their solutions cater to a diverse range of applications, emphasizing sustainability and precision.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

20 Patents

#7 in Yavne

#304 in Israel

#31,233 in the World

Highcon Systems Ltd.

Forward Citations = 19

21 inventors:

Michael Zimmer (7 out of 8 patents)

Claudio Rottman (5 out of 19 patents)

David Ben-David (4 out of 9 patents)

4. Michael Karp (4 out of 10 patents)

5. Kostantin Spiryagin (4 out of 4 patents)

Please report any incorrect information to [email protected]

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