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For the Inventor, By the Inventor

Yavne, Israel

Highcon Systems Ltd.

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USPTO Granted Patents = 20


Trademarks = 1

Forward Citations = 19

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21 inventors (with patents filed for the assignee):

goldMedal Michael Zimmer (7 out of 8 patents)

silverMedal Claudio Rottman (5 out of 19 patents)

bronzeMedal David Ben-David (4 out of 9 patents)

4.  Michael Karp (4 out of 10 patents)

5.  Kostantin Spiryagin (4 out of 4 patents)

6.  Aviv Ratzman (4 out of 5 patents)

7.  David Idan (4 out of 5 patents)

8.  Lior Dahan (4 out of 5 patents)

9.  Ron Or (2 out of 2 patents)

10.  Natalia Zlotnikov (2 out of 2 patents)

11.  Eli Ireni (2 out of 3 patents)

12.  Yaki Stern (2 out of 11 patents)

13.  Rainer Buschulte (2 out of 12 patents)

14.  Lior Sirkis (1 out of 1 patent)

15.  Yaron Smirnov (1 out of 1 patent)


20 patents:

1. 12552125 - Method and system for cardboard pretreatment (2026-02-17),
2. 12202972 - Method and system for creating co-layer surface adhesive rule (2025-01-21),
3. 12194509 - System and method for cleaning a laser cut substrate (2025-01-14),
4. 11858776 - Sheet conveying apparatus (2024-01-02),
5. 11780108 - Method and apparatus for substrate stripping (2023-10-10),
6. 11667099 - System for creating a relief pattern on a substrate (2023-06-06),
7. 11135803 - System for impressing a relief pattern on a substrate (2021-10-05),
8. 11130307 - Polymeric rule die, and formulations therefor (2021-09-28),
9. 11059253 - Method and system for cardboard pretreatment (2021-07-13),
10. 10625485 - Polymeric rule die, and formulations therefor (2020-04-21),
11. 10556415 - Method and apparatus for building a 3D object from layers of pre-stripped substrate (2020-02-11),
12. 10427248 - Cardboard-handling system and method (2019-10-01),
13. 9545638 - Method and system for a multiple-orifice nozzle (2017-01-17),
14. 9492984 - Systems and methods for treating and handling cardboard sheets (2016-11-15),
15. 9436012 - Method and apparatus for laser cutting (2016-09-06),
Company Overview
Highcon Systems Ltd. is a technology company based in Yavne, Israel, specializing in digital cutting and creasing solutions for the packaging industry. The company focuses on developing innovative machinery that enhances efficiency and flexibility in the production of packaging materials. Highcon's technology integrates advanced software and hardware to streamline workflows, enabling manufacturers to respond swiftly to market demands while reducing waste and operational costs. Their solutions cater to a diverse range of applications, emphasizing sustainability and precision.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

20 Patents

#7 in Yavne

#308 in Israel

#31,315 in the World

Yavne, IL
Yavne, Israel

Highcon Systems Ltd.

Forward Citations = 19

21 inventors:

goldMedal Michael Zimmer (7 out of 8 patents)

silverMedal Claudio Rottman (5 out of 19 patents)

bronzeMedal David Ben-David (4 out of 9 patents)

4.  Michael Karp (4 out of 10 patents)

5.  Kostantin Spiryagin (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Highcon Systems Ltd.. Retrieved from https://idiyas.com/company/highcon-systems

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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