The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

May. 25, 2017
Applicant:

Highcon Systems Ltd., Yavne, IL;

Inventors:

Ron Or, Tel Aviv, IL;

Michael Karp, Petah-Tikva, IL;

Claudio Rottman, Modiin, IL;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B31F 1/07 (2006.01); B31F 1/10 (2006.01); B29C 59/02 (2006.01); B31F 1/08 (2006.01); B29C 59/04 (2006.01); B44B 5/00 (2006.01); B44B 5/02 (2006.01);
U.S. Cl.
CPC ...
B31F 1/07 (2013.01); B29C 59/02 (2013.01); B29C 59/046 (2013.01); B31F 1/08 (2013.01); B31F 1/10 (2013.01); B44B 5/0047 (2013.01); B44B 5/026 (2013.01); B31F 2201/0702 (2013.01); B31F 2201/0733 (2013.01); B31F 2201/0738 (2013.01);
Abstract

A die and counter die system for impressing a relief pattern onto a substrate, including a male die film and at least one female die. The female die includes a female-die contact surface including at least one cavity defining the relief pattern. The male die film includes a flexible male-die contact surface which is featureless in a region thereof opposing the relief pattern on the at least one female die. The system further includes a compression mechanism adapted, when the substrate is disposed between the male die contact surface and the female die contact surface, to move the male die film and the at least one female die towards one another so as to impress the relief pattern on the substrate.


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