The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

May. 25, 2017
Applicant:

Highcon Systems Ltd., Yavne, IL;

Inventors:

Ron Or, Tel Aviv, IL;

Michael Karp, Petah-Tikva, IL;

Claudio Rottman, Modiin, IL;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B31F 1/07 (2006.01); B31F 1/10 (2006.01); B44B 5/00 (2006.01); B44B 5/02 (2006.01); B31F 1/08 (2006.01); B29C 59/04 (2006.01);
U.S. Cl.
CPC ...
B31F 1/07 (2013.01); B29C 59/046 (2013.01); B31F 1/08 (2013.01); B31F 1/10 (2013.01); B44B 5/0047 (2013.01); B44B 5/026 (2013.01);
Abstract

A die and counter die system for impressing a relief pattern onto a substrate, including at least one male die including a contact surface and defining a relief pattern, a compressible counter film including a base layer, a contact layer disposed opposite the contact surface of the at least one male die and spaced therefrom, and a compressible layer disposed between the base layer and the contact layer and attached thereto. The contact layer is featureless in a region thereof opposing the relief pattern on the at least one male die. The compressible counter film has a compressibility, in a direction perpendicular to a broad face of the compressible counter film, in the range of 5-30% at 1.35 MPa. The system further includes a compression mechanism adapted to move the at least one male die and the compressible counter film towards one another in an operative mode.


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