For the Inventor, By the Inventor

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Kanagawa, Japan

Hemicellulose Ltd.

USPTO Granted Patents = 2

EPO Patents = 2

Trademarks = 1

Forward Citations = 0

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4 inventors (with patents filed for the assignee):

Kenichi Sato (2 out of 65 patents)

Seiji Morita (2 out of 128 patents)

Jin Nasukawa (2 out of 2 patents)

4. Laksmi Kusumawardhani (2 out of 2 patents)

5. Laksmi Kusuma Wardhani (0 patent)

6. Laksmi Kusuma Wardhani (0 patent)

2 patents: Sort by Forward Citations

1. 11807751 - Resin composition and molding method thereof (2023-11-07),

2. 11767382 - Resin composition and molding method thereof (2023-09-26),

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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#354 in Kanagawa

#10,966 in Japan

Kanagawa, Japan

Hemicellulose Ltd.

Forward Citations = 0

4 inventors:

Kenichi Sato (2 out of 65 patents)

Seiji Morita (2 out of 128 patents)

Jin Nasukawa (2 out of 2 patents)

4. Laksmi Kusumawardhani (2 out of 2 patents)

5. Laksmi Kusuma Wardhani (0 patent)

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