The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2023

Filed:

Dec. 05, 2019
Applicant:

Hemicellulose Ltd., Kanagawa, JP;

Inventors:

Seiji Morita, Tokyo, JP;

Jin Nasukawa, Tokyo, JP;

Kenichi Sato, Tokyo, JP;

Laksmi Kusumawardhani, Tokyo, JP;

Assignee:

Hemicellulose Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 5/14 (2006.01); B29C 45/18 (2006.01); B29C 45/56 (2006.01); B29C 45/73 (2006.01); B29C 45/74 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 33/12 (2006.01); C08L 67/02 (2006.01); C08L 67/04 (2006.01); C08L 69/00 (2006.01);
U.S. Cl.
CPC ...
C08L 5/14 (2013.01); B29C 45/1816 (2013.01); B29C 45/561 (2013.01); B29C 45/7337 (2013.01); B29C 45/74 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 33/12 (2013.01); C08L 67/02 (2013.01); C08L 67/04 (2013.01); C08L 69/00 (2013.01); B29C 2945/76361 (2013.01); B29K 2005/00 (2013.01);
Abstract

A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.


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