The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Dec. 05, 2019
Hemicellulose Ltd., Kanagawa, JP;
Seiji Morita, Tokyo, JP;
Jin Nasukawa, Tokyo, JP;
Kenichi Sato, Tokyo, JP;
Laksmi Kusumawardhani, Tokyo, JP;
Hemicellulose Ltd., Kanagawa, JP;
Abstract
A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness, and biodegradability is provided by using an amorphous resin material component extracted from plant-derived wood. The resin composition is a hemicellulose monomer obtained by applying a methacrylation reaction or acrylation reaction to a hemicellulose or hemicellulose derivative and has a molecular structure in which a methacrylic group or acryloyl group is bonded to the hemicellulose or hemicellulose derivative. This hemicellulose monomer has excellent injection moldability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile