He Bei Sinopack Electronic Tech Co., Ltd.

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USPTO Granted Patents = 3

Forward Citations = 1

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11 inventors (with patents filed for the assignee):

Linjie Liu (2 out of 4 patents)

Fei Ding (2 out of 2 patents)

Jing Sun (1 out of 5 patents)

4. Yao Liu (1 out of 1 patent)

5. Jun Li (1 out of 1 patent)

6. Jing Zhao (1 out of 1 patent)

7. Bin Liang (1 out of 1 patent)

8. Lin Feng Zhou (1 out of 1 patent)

9. Di Gao (1 out of 1 patent)

10. Dongliang Zhao (1 out of 1 patent)

11. Lei Zhang (1 out of 2 patents)

3 patents: Sort by Forward Citations

1. 11309439 - Package structure for semiconductor device, and semiconductor device (2022-04-19),

2. 9999125 - Method for fabricating ceramic insulator for electronic packaging (2018-06-12),

3. 9713252 - Ceramic insulator for electronic packaging and method for fabricating the same (2017-07-18),

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USPTO Data Jan 1 1976 - Oct 27 2026

3 Patents

#15 in Shijiazhuang

#8,379 in China

Shijiazhuang, China