logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11309439 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Nov. 09, 2018

Package structure for semiconductor device, and semiconductor device

Applicant:

He Bei Sinopack Electronic Tech Co., Ltd., Shijiazhuang, CN;

Inventors:

Yao Liu, Shijiazhuang, CN;

Jun Li, Shijiazhuang, CN;

Jing Zhao, Shijiazhuang, CN;

Jing Sun, Shijiazhuang, CN;

Bin Liang, Shijiazhuang, CN;

Lin Feng Zhou, Shijiazhuang, CN;

Di Gao, Shijiazhuang, CN;

Assignee:

He Bei Sinopack Electronic Tech Co., Ltd., Shijiazhuang, CN;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 23/08 (2006.01); H01L 23/10 (2006.01); H01L 31/0203 (2014.01); H01L 31/024 (2014.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02002 (2013.01); H01L 23/055 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01);
Abstract

A package structure comprises a metal plate () where a slot is formed, a ceramic piece (), and a metal heat sink () welded onto the back surface of the ceramic piece (). The ceramic piece () and the metal heat sink () are vertically inserted into the slot and welded to the metal plate (). A semiconductor and a matching circuit may be disposed on the metal heat sink (). The ceramic piece () replaces a glass seal; metalized interconnection is provided inside the ceramic piece () for fabricating a metalized pattern having complex connection relations, and the electrical interconnection is more flexible. In the package structure, metalized wiring is carried out by using the ceramic piece. Compared with round lead machining, higher precision is achieved.

Find Patent Forward Citations

Liu, Yao. (2022). Package structure for semiconductor device, and semiconductor device (U.S. Patent No. 11309439). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11309439

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…