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For the Inventor, By the Inventor

Changwon-Si, South Korea

Haesung Ds Co., Ltd.


USPTO Granted Patents = 5

Forward Citations = 0

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10 inventors (with patents filed for the assignee):

goldMedal Seung Seob Lee (1 out of 1 patent)

silverMedal Chonghan Park (1 out of 1 patent)

bronzeMedal Seok Kyu Seo (1 out of 2 patents)

4.  Dong Young Pyeon (1 out of 3 patents)

5.  Hyun Tae Lim (1 out of 1 patent)

6.  Dong Jin Yoon (1 out of 1 patent)

7.  Sung Il Kang (1 out of 1 patent)

8.  In Seob Bae (1 out of 1 patent)

9.  Jae Hoon Jang (1 out of 1 patent)

10.  Yong Nam Kim (1 out of 1 patent)


5 patents:

1. 12662343 - Reel-to-reel surface press apparatus (2026-06-23),
2. 12628667 - Semiconductor package substrate having front and back side resin-filled trenches and method of manufacturing the same (2026-05-12),
3. 12621935 - Reel-to-reel circuit board manufacturing apparatus (2026-05-05),
4. 12601541 - Reel-to-reel component drying apparatus (2026-04-14),
5. 12581601 - Reel-to-reel circuit board manufacturing apparatus (2026-03-17),
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USPTO Data Jan 1 1976 - Sep 29 2026

5 Patents

#308 in CHANGWON-SI

#1,875 in South Korea

Changwon-Si, KR
Changwon-Si, South Korea

Haesung Ds Co., Ltd.

Forward Citations = 0

10 inventors:

goldMedal Seung Seob Lee (1 out of 1 patent)

silverMedal Chonghan Park (1 out of 1 patent)

bronzeMedal Seok Kyu Seo (1 out of 2 patents)

4.  Dong Young Pyeon (1 out of 3 patents)

5.  Hyun Tae Lim (1 out of 1 patent)

Please report any incorrect information to [email protected]
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