The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Sep. 07, 2022
Haesung Ds Co., Ltd., Gyeongsangnam-do, KR;
Dong Jin Yoon, Gyeongsangnam-do, KR;
Sung Il Kang, Gyeongsangnam-do, KR;
In Seob Bae, Gyeongsangnam-do, KR;
Seok Kyu Seo, Gyeongsangnam-do, KR;
Dong Young Pyeon, Gyeonggi-do, KR;
HAESUNG DS CO., LTD, Gyeongsangnam-Do, KR;
Abstract
Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trench is provided and an upper surface in which a second trench and a third trench are provided, including a circuit pattern and a conductive material; a first resin arranged in the first trench; and a second resin arranged in the second trench and the third trench, wherein the second trench exposes at least a part of the first resin.