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Forward Citations = 368

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7 inventors (with patents filed for the assignee):

E Jennings Taylor (14 out of 35 patents)

Jenny J Sun (11 out of 15 patents)

Chengdong Zhou (7 out of 9 patents)

4. Maria E Inman (3 out of 14 patents)

5. Lawrence E Gebhart (3 out of 7 patents)

6. Heather Dyar (1 out of 1 patent)

7. Robert P Renz (1 out of 3 patents)

16 patents: Sort by Forward Citations

1. 7022216 - Electrolytic etching of metal layers (2006-04-04),

2. 6878259 - Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates (2005-04-12),

3. 6863793 - Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes (2005-03-08),

4. 6827833 - Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields (2004-12-07),

5. 6750144 - Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes (2004-06-15),

6. 6676825 - Removal of sacrificial cores by electrochemical machining (2004-01-13),

7. 6652727 - Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes (2003-11-25),

8. 6551485 - Electrodeposition of metals for forming three-dimensional microstructures (2003-04-22),

9. 6524461 - Electrodeposition of metals in small recesses using modulated electric fields (2003-02-25),

10. 6402931 - Electrochemical machining using modulated reverse electric fields (2002-06-11),

11. 6319384 - Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates (2001-11-20),

12. 6309528 - Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes (2001-10-30),

13. 6303014 - Electrodeposition of metals in small recesses using modulated electric fields (2001-10-16),

14. 6221235 - Removal of sacrificial cores by electrochemical machining (2001-04-24),

15. 6210555 - Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating (2001-04-03),

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USPTO Data Jan 1 1976 - Dec 2 2025

16 Patents

#5 in Troy, OH

#804 in Ohio

#19,264 in US

#36,617 in the World

Troy, OH, United States of America

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