The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2004
Filed:
Feb. 14, 2003
E. Jennings Taylor, Troy, OH (US);
Faraday Technology Marketing Group, LLC, Troy, OH (US);
Abstract
A method for filling recesses of different sizes on a semiconductor substrate comprising immersing a semiconductor substrate having a surface provided with recesses of different sizes in an electroplating bath containing ions of a metal to be deposited on the surface; immersing a counter electrode in the plating bath; passing an electric current between the substrate and the counterelectrode; wherein, in a first electroplating step, the electric current is a modulated reversing electric current comprising a train of pulses that are cathodic with respect to the substrate and pulses that are anodic with respect to the substrate, whereby the pulse train in the first step has a first period, the cathodic pulses have an on-time of from about 0.83 microseconds to about 50 milliseconds and the anodic pulses have an on-time of from about 42 microseconds to about 99 milliseconds, the cathodic and anodic pulses have a charge transfer ratio of the cathodic pulses to the anodic pulses that is greater than one; in a second electroplating step, the electric current is a, modulated reversing electric current comprising a train of pulses that are cathodic with respect to the substrate.