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For the Inventor, By the Inventor

St. Florian, Austria

Ev Group Gmbh


USPTO Granted Patents = 29


Forward Citations = 42

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18 inventors (with patents filed for the assignee):

goldMedal Friedrich Paul Lindner (14 out of 39 patents)

silverMedal Markus Wimplinger (9 out of 70 patents)

bronzeMedal Jurgen Burggraf (6 out of 17 patents)

4.  Michael Kast (6 out of 11 patents)

5.  Erich Thallner (6 out of 46 patents)

6.  Jürgen Burggraf (4 out of 11 patents)

7.  Herbert Tiefenböck (4 out of 6 patents)

8.  Stefan Pargfrieder (3 out of 3 patents)

9.  Daniel Burgstaller (3 out of 6 patents)

10.  Wolfgang Tiefenböck (2 out of 2 patents)

11.  Thomas Wagenleitner (1 out of 47 patents)

12.  Thomas Glinsner (1 out of 11 patents)

13.  Ronald Holzleitner (1 out of 2 patents)

14.  Peter Oliver Hangweier (1 out of 1 patent)

15.  Peter-Oliver Hangweier (1 out of 1 patent)


Core Competencies:
Wafer Processing
Microlens Production
Substrate Detaching
Lens Wafer
Automated Coupling
Wafer Alignment
Interconnect Layer
Semiconductor Substrates
Stripping Device
Handling Device
Bonding Chips
Machining Workpiece

29 patents:

1. 10668678 - Die tool, device and method for producing a lens wafer (2020-06-02),
2. 10279551 - Method for producing a microlens (2019-05-07),
3. 9925597 - Chuck adapted for automated coupling (2018-03-27),
4. 9771223 - Device and method for processing of wafers (2017-09-26),
5. 9751698 - Device and method for processing wafers (2017-09-05),
6. 9738042 - Die tool, device and method for producing a lens wafer (2017-08-22),
7. 9662846 - Method and device for producing a lens wafer (2017-05-30),
8. 9643366 - Method and device for producing a lens wafer (2017-05-09),
9. 9555479 - Chuck adapted for automated coupling (2017-01-31),
10. 9457552 - Method for detaching a product substrate off a carrier substrate (2016-10-04),
11. 9449863 - Device for aligning and pre-fixing a wafer (2016-09-20),
12. 9381732 - Device for stripping a product substrate from a carrier substrate (2016-07-05),
13. 9381729 - Device for detaching a product substrate off a carrier substrate (2016-07-05),
14. 9278433 - Receiving device for receiving semiconductor substrates (2016-03-08),
15. 9272501 - Device for detaching a product substrate off a carrier substrate (2016-03-01),
Ev Group GmbH, based in St. Florian, Austria, specializes in advanced manufacturing solutions for the semiconductor and microelectronics industries. The company is renowned for its expertise in wafer bonding, lithography, and nanoimprint technology, which are critical for the development of next-generation devices. Ev Group's innovative approaches support a wide range of applications, including MEMS, optoelectronics, and advanced packaging, contributing to the evolution of high-tech sectors globally.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Ev Group Gmbh
29 Patents

#2 in St. Florian

#126 in Austria

#22,510 in the World

St. Florian, AT
St. Florian, Austria

Ev Group Gmbh

Forward Citations = 42

18 inventors:

goldMedal Friedrich Paul Lindner (14 out of 39 patents)

silverMedal Markus Wimplinger (9 out of 70 patents)

bronzeMedal Jurgen Burggraf (6 out of 17 patents)

4.  Michael Kast (6 out of 11 patents)

5.  Erich Thallner (6 out of 46 patents)

Please report any incorrect information to [email protected]
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