For the Inventor, By the Inventor

Enter assignee name

St. Florian am Inn, Austria

Ev Group Gmbh

USPTO Granted Patents = 29

CIPO Patents = 2

EPO Patents = 26

Forward Citations = 42

Loading Chart...

Loading Chart...

24 inventors (with patents filed for the assignee):

Friedrich Paul Lindner (14 out of 39 patents)

Markus Wimplinger (9 out of 70 patents)

Jurgen Burggraf (6 out of 16 patents)

4. Michael Kast (6 out of 11 patents)

5. Erich Thallner (6 out of 46 patents)

6. Jürgen Burggraf (4 out of 11 patents)

7. Herbert Tiefenböck (4 out of 6 patents)

8. Stefan Pargfrieder (3 out of 3 patents)

9. Daniel Burgstaller (3 out of 6 patents)

10. Wolfgang Tiefenböck (2 out of 2 patents)

11. Thomas Wagenleitner (1 out of 45 patents)

12. Thomas Glinsner (1 out of 11 patents)

13. Ronald Holzleitner (1 out of 2 patents)

14. Peter Oliver Hangweier (1 out of 1 patent)

15. Peter-Oliver Hangweier (1 out of 1 patent)

29 patents: Sort by Forward Citations

1. 10668678 - Die tool, device and method for producing a lens wafer (2020-06-02),

2. 10279551 - Method for producing a microlens (2019-05-07),

3. 9925597 - Chuck adapted for automated coupling (2018-03-27),

4. 9771223 - Device and method for processing of wafers (2017-09-26),

5. 9751698 - Device and method for processing wafers (2017-09-05),

6. 9738042 - Die tool, device and method for producing a lens wafer (2017-08-22),

7. 9662846 - Method and device for producing a lens wafer (2017-05-30),

8. 9643366 - Method and device for producing a lens wafer (2017-05-09),

9. 9555479 - Chuck adapted for automated coupling (2017-01-31),

10. 9457552 - Method for detaching a product substrate off a carrier substrate (2016-10-04),

11. 9449863 - Device for aligning and pre-fixing a wafer (2016-09-20),

12. 9381732 - Device for stripping a product substrate from a carrier substrate (2016-07-05),

13. 9381729 - Device for detaching a product substrate off a carrier substrate (2016-07-05),

14. 9278433 - Receiving device for receiving semiconductor substrates (2016-03-08),

15. 9272501 - Device for detaching a product substrate off a carrier substrate (2016-03-01),

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacturing of semiconductors, MEMS, and other microdevices. With a global presence in the semiconductor industry for more than 40 years, EVG offers a comprehensive portfolio of wafer bonding, lithography/nanoimprint lithography (NIL), metrology, oxide and resist removal, and wafer cleaning solutions. Their innovative technologies and expertise enable customers to achieve high-quality and cost-effective production processes. Visit their website for more information about their products, services, and industry collaborations.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

29 Patents

#2 in St. Florian am Inn

#126 in Austria

#21,844 in the World

St. Florian am Inn, Austria

Ev Group Gmbh

Forward Citations = 42

24 inventors:

Friedrich Paul Lindner (14 out of 39 patents)

Markus Wimplinger (9 out of 70 patents)

Jurgen Burggraf (6 out of 16 patents)

4. Michael Kast (6 out of 11 patents)

5. Erich Thallner (6 out of 46 patents)

Please report any incorrect information to support@idiyas.com

Loading…