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St. Florian, Austria

Ev Group Gmbh

USPTO Granted Patents = 29

EPO Patents = 26

Forward Citations = 42

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18 inventors (with patents filed for the assignee):

Friedrich Paul Lindner (14 out of 39 patents)

Markus Wimplinger (9 out of 70 patents)

Jurgen Burggraf (6 out of 17 patents)

4. Michael Kast (6 out of 11 patents)

5. Erich Thallner (6 out of 46 patents)

6. Jürgen Burggraf (4 out of 11 patents)

7. Herbert Tiefenböck (4 out of 6 patents)

8. Stefan Pargfrieder (3 out of 3 patents)

9. Daniel Burgstaller (3 out of 6 patents)

10. Wolfgang Tiefenböck (2 out of 2 patents)

11. Thomas Wagenleitner (1 out of 47 patents)

12. Thomas Glinsner (1 out of 11 patents)

13. Ronald Holzleitner (1 out of 2 patents)

14. Peter Oliver Hangweier (1 out of 1 patent)

15. Peter-Oliver Hangweier (1 out of 1 patent)

Core Competencies:

Wafer Processing

Microlens Production

Substrate Detaching

Lens Wafer

Automated Coupling

Wafer Alignment

Interconnect Layer

Semiconductor Substrates

Stripping Device

Handling Device

Bonding Chips

Machining Workpiece

29 patents: Sort by Forward Citations

1. 10668678 - Die tool, device and method for producing a lens wafer (2020-06-02),

2. 10279551 - Method for producing a microlens (2019-05-07),

3. 9925597 - Chuck adapted for automated coupling (2018-03-27),

4. 9771223 - Device and method for processing of wafers (2017-09-26),

5. 9751698 - Device and method for processing wafers (2017-09-05),

6. 9738042 - Die tool, device and method for producing a lens wafer (2017-08-22),

7. 9662846 - Method and device for producing a lens wafer (2017-05-30),

8. 9643366 - Method and device for producing a lens wafer (2017-05-09),

9. 9555479 - Chuck adapted for automated coupling (2017-01-31),

10. 9457552 - Method for detaching a product substrate off a carrier substrate (2016-10-04),

11. 9449863 - Device for aligning and pre-fixing a wafer (2016-09-20),

12. 9381732 - Device for stripping a product substrate from a carrier substrate (2016-07-05),

13. 9381729 - Device for detaching a product substrate off a carrier substrate (2016-07-05),

14. 9278433 - Receiving device for receiving semiconductor substrates (2016-03-08),

15. 9272501 - Device for detaching a product substrate off a carrier substrate (2016-03-01),

Company Overview

Ev Group GmbH, based in St. Florian, Austria, specializes in advanced manufacturing solutions for the semiconductor and microelectronics industries. The company is renowned for its expertise in wafer bonding, lithography, and nanoimprint technology, which are critical for the development of next-generation devices. Ev Group's innovative approaches support a wide range of applications, including MEMS, optoelectronics, and advanced packaging, contributing to the evolution of high-tech sectors globally.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

29 Patents

#2 in St. Florian

#126 in Austria

#22,570 in the World

St. Florian, Austria

Ev Group Gmbh

Forward Citations = 42

18 inventors:

Friedrich Paul Lindner (14 out of 39 patents)

Markus Wimplinger (9 out of 70 patents)

Jurgen Burggraf (6 out of 17 patents)

4. Michael Kast (6 out of 11 patents)

5. Erich Thallner (6 out of 46 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ev Group Gmbh. Retrieved from https://idiyas.com/company/ev-group

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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