The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Nov. 25, 2014
Applicant:

Ev Group Gmbh, St. Florian, AT;

Inventors:

Friedrich Paul Lindner, Scharding, AT;

Jurgen Burggraf, Scharding, AT;

Assignee:

EV Group GmbH, St. Florian, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B32B 38/10 (2013.01); B32B 43/003 (2013.01); H01L 21/67132 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); B32B 2457/14 (2013.01); H01L 2221/6839 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10S 156/942 (2013.01); Y10T 156/11 (2015.01); Y10T 156/1111 (2015.01); Y10T 156/1121 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/19 (2015.01); Y10T 156/1922 (2015.01); Y10T 156/1961 (2015.01); Y10T 156/1967 (2015.01);
Abstract

Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.


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