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For the Inventor, By the Inventor

Eschenbach, Germany

Curamik Electronics Gmbh


USPTO Granted Patents = 27

% Expired Patents = 66.7


Trademarks = 1

Forward Citations = 215

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19 inventors (with patents filed for the assignee):

goldMedal Jürgen Schulz-Harder (24 out of 31 patents)

silverMedal Karl Exel (8 out of 9 patents)

bronzeMedal Andreas Meyer (6 out of 25 patents)

4.  Ernst Hammel (5 out of 15 patents)

5.  Ben Zhong Tang (3 out of 9 patents)

6.  Ka Chun Tse (3 out of 5 patents)

7.  Xinhe Tang (3 out of 8 patents)

8.  Karsten Schmidt (2 out of 12 patents)

9.  Bernd Medick (2 out of 2 patents)

10.  Veronika Bauer-Schulz-Harder (2 out of 2 patents)

11.  Alexander Rogg (1 out of 5 patents)

12.  Volker Krause (1 out of 14 patents)

13.  Kai Kriegel (1 out of 4 patents)

14.  Christoph Ullmann (1 out of 5 patents)

15.  Andreas Karl Frischmann (1 out of 1 patent)


Core Competencies:
Metal-Ceramic Substrate
Peltier Modules
Cooling Devices
Heat Sink
Nanofiber Material
Printed Circuit Board
Electrical Module
Composite Material
Diode Laser Array
Conductor Board
Heat Exchanger

27 patents:

1. 8749052 - Electronic device (2014-06-10),
2. 8683682 - Method for the production of a metal-ceramic substrate (2014-04-01),
3. 8584924 - Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate (2013-11-19),
4. 8559475 - Heat sink and assembly or module unit (2013-10-15),
5. 8519530 - Method for treating nanofiber material and composition of nanofiber material (2013-08-27),
6. 8481842 - Process for producing Peltier modules, and Peltier module (2013-07-09),
7. 8435640 - Metal-ceramic substrate (2013-05-07),
8. 8377240 - Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method (2013-02-19),
9. 8342384 - Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate (2013-01-01),
10. 8304054 - Printed circuit board made from a composite material (2012-11-06),
11. 8130807 - Diode laser array and method for manufacturing such an array (2012-03-06),
12. 8119220 - Composite material, especially multilayer material, and adhesive or bonding material (2012-02-21),
13. 8069561 - Method for manufacturing a metal-ceramic substrate (2011-12-06),
14. 8056230 - Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks (2011-11-15),
15. 8021920 - Method for producing a metal-ceramic substrate for electric circuits on modules (2011-09-20),
Curamik Electronics GmbH specializes in the development and manufacturing of advanced ceramic substrates and components for the electronics industry. The company focuses on high-performance materials that enhance thermal management and electrical insulation in various applications. With a strong emphasis on innovation, Curamik serves sectors such as automotive, telecommunications, and industrial electronics, contributing to the advancement of reliable and efficient electronic systems. Headquartered in Eschenbach, Germany, Curamik is positioned to meet the evolving needs of global markets.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

27 Patents

#2 in Eschenbach

#1,739 in Germany

#23,968 in the World

Eschenbach, DE
Eschenbach, Germany

Curamik Electronics Gmbh

Forward Citations = 215

19 inventors:

goldMedal Jürgen Schulz-Harder (24 out of 31 patents)

silverMedal Karl Exel (8 out of 9 patents)

bronzeMedal Andreas Meyer (6 out of 25 patents)

4.  Ernst Hammel (5 out of 15 patents)

5.  Ben Zhong Tang (3 out of 9 patents)

Please report any incorrect information to [email protected]
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