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Eschenbach, Germany

Curamik Electronics Gmbh

USPTO Granted Patents = 27

EPO Patents = 9

Trademarks = 4

Forward Citations = 209

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19 inventors (with patents filed for the assignee):

Jürgen Schulz-Harder (24 out of 31 patents)

Karl Exel (8 out of 9 patents)

Andreas Meyer (6 out of 24 patents)

4. Ernst Hammel (5 out of 15 patents)

5. Ben Zhong Tang (3 out of 9 patents)

6. Ka Chun Tse (3 out of 5 patents)

7. Xinhe Tang (3 out of 8 patents)

8. Karsten Schmidt (2 out of 11 patents)

9. Bernd Medick (2 out of 2 patents)

10. Veronika Bauer-Schulz-Harder (2 out of 2 patents)

11. Alexander Rogg (1 out of 5 patents)

12. Volker Krause (1 out of 14 patents)

13. Kai Kriegel (1 out of 4 patents)

14. Christoph Ullmann (1 out of 4 patents)

15. Andreas Karl Frischmann (1 out of 1 patent)

27 patents: Sort by Forward Citations

1. 8749052 - Electronic device (2014-06-10),

2. 8683682 - Method for the production of a metal-ceramic substrate (2014-04-01),

3. 8584924 - Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate (2013-11-19),

4. 8559475 - Heat sink and assembly or module unit (2013-10-15),

5. 8519530 - Method for treating nanofiber material and composition of nanofiber material (2013-08-27),

6. 8481842 - Process for producing Peltier modules, and Peltier module (2013-07-09),

7. 8435640 - Metal-ceramic substrate (2013-05-07),

8. 8377240 - Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method (2013-02-19),

9. 8342384 - Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate (2013-01-01),

10. 8304054 - Printed circuit board made from a composite material (2012-11-06),

11. 8130807 - Diode laser array and method for manufacturing such an array (2012-03-06),

12. 8119220 - Composite material, especially multilayer material, and adhesive or bonding material (2012-02-21),

13. 8069561 - Method for manufacturing a metal-ceramic substrate (2011-12-06),

14. 8056230 - Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks (2011-11-15),

15. 8021920 - Method for producing a metal-ceramic substrate for electric circuits on modules (2011-09-20),

Curamik Electronics GmbH is a leading manufacturer of high-performance ceramic electronic components based in Germany. With over 30 years of experience, Curamik specializes in the production of various ceramic substrates, circuit carriers, and electronic modules for industries such as power electronics, automotive, telecommunications, aerospace, and more. Their innovative solutions offer exceptional thermal conductivity, electrical insulation, mechanical stability, and reliability. Curamik Electronics GmbH is committed to delivering cutting-edge ceramic technologies to meet the evolving needs of their global clientele.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

27 Patents

#1 in Eschenbach

#1,768 in Germany

#23,293 in the World

Eschenbach, Germany

Curamik Electronics Gmbh

Forward Citations = 209

19 inventors:

Jürgen Schulz-Harder (24 out of 31 patents)

Karl Exel (8 out of 9 patents)

Andreas Meyer (6 out of 24 patents)

4. Ernst Hammel (5 out of 15 patents)

5. Ben Zhong Tang (3 out of 9 patents)

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