The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Oct. 05, 2005
Jurgen Schulz-harder, Lauf, DE;
Andreas Karl Frischmann, Vienna, AT;
Alexander Rogg, Speinshart, DE;
Karl Exel, Rimbach, DE;
Jurgen Schulz-Harder, Lauf, DE;
Andreas Karl Frischmann, Vienna, AT;
Alexander Rogg, Speinshart, DE;
Karl Exel, Rimbach, DE;
Curamik Electronics GmbH, Eschenbach, DE;
Abstract
A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, AlO, TiO, ZrO, MgO, CaO CaCOor a mixture of at least two of said materials.