The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2014

Filed:

Apr. 23, 2005
Applicant:

Jurgen Schulz-harder, Lauf, DE;

Inventor:
Assignee:

Curamik Electronics GmbH, Eschenbach, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method for producing a metal-ceramic substrate. According to said method, a metal layer is applied to at least one face of a ceramic substrate or a ceramic layer by means of a direct bonding process, and the metal-ceramic substrate or partial substrate is aftertreated in a subsequent step at a gas pressure (aftertreatment pressure) ranging approximately between 400 and 2000 bar and an aftertreatment temperature ranging approximately.


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