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Cemedine Co., Ltd.

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USPTO Granted Patents = 30

EPO Patents = 9

Trademarks = 3

Forward Citations = 252

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67 inventors (with patents filed for the assignee):

Naomi Okamura (16 out of 17 patents)

Akio Nimura (6 out of 7 patents)

Atsushi Saito (5 out of 54 patents)

4. Tomonori Saito (4 out of 4 patents)

5. Takao Hino (4 out of 5 patents)

6. Hiroshi Yamaga (3 out of 3 patents)

7. Hiroshi Aoki (3 out of 66 patents)

8. Chiaki Hata (3 out of 8 patents)

9. Hideharu Hashimukai (3 out of 3 patents)

10. Masayuki Fukai (3 out of 4 patents)

11. Keizi Shimizu (3 out of 4 patents)

12. Eiichi Okuno (3 out of 3 patents)

13. Shouma Kouno (2 out of 2 patents)

14. Tomohiro Midorikawa (2 out of 2 patents)

15. Takashi Saitoh (2 out of 95 patents)

Core Competencies:

Curable Composition

Photocurable Composition

Epoxy Resin

Pressure-Sensitive Adhesive

Moisture Curable

Fireproofing

Adhesive Properties

Two-Pack Type

Room Temperature Cure

Bonding Method

Extrusion Device

Composite Pressure Sensitive Plate

30 patents: Sort by Forward Citations

1. 11827818 - Photocurable composition and product (2023-11-28),

2. 11827773 - Curable composition for fireproofing (2023-11-28),

3. 11680193 - Low-temperature heat-curable adhesive composition for structure (2023-06-20),

4. 11618839 - Structure adhesive composition exhibiting favorable thread breakage and capable of stitch coating (2023-04-04),

5. 10920068 - Two-pack type epoxy resin composition (2021-02-16),

6. 10844251 - Pressure-sensitive adhesive (2020-11-24),

7. 10450487 - One-part water-based adhesive composition (2019-10-22),

8. 9745406 - Curable composition (2017-08-29),

9. 9718999 - Photocurable composition having adhesive properties (2017-08-01),

10. 8519049 - Curable composition (2013-08-27),

11. 8217130 - Curable composition and method for producing the same (2012-07-10),

12. RE41805 - Moisture curable composition (2010-10-04),

13. 7781559 - Curable composition and method for producing the same (2010-08-24),

14. 6306966 - Moisture curable composition (2001-10-23),

15. 6280562 - Contact adhering method (2001-08-28),

Company Overview

Cemedine Co., Ltd. is a prominent Japanese company specializing in the development and manufacturing of adhesives, sealants, and related chemical products. With a strong focus on innovation, Cemedine serves various industries, including construction, automotive, and electronics, providing solutions that enhance product performance and durability. The company is committed to advancing adhesive technology, ensuring high-quality standards, and meeting the diverse needs of its global clientele.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

30 Patents

#1,062 in Tokyo

#2,307 in Japan

#21,924 in the World

Cemedine Co., Ltd.

Forward Citations = 252

67 inventors:

Naomi Okamura (16 out of 17 patents)

Akio Nimura (6 out of 7 patents)

Atsushi Saito (5 out of 54 patents)

4. Tomonori Saito (4 out of 4 patents)

5. Takao Hino (4 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Cemedine Co., Ltd.. Retrieved from https://idiyas.com/company/cemedine-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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