The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Jul. 09, 2012
Applicants:

Atsushi Saito, Shinagawa-ku, JP;

Masaki Ito, Shinagawa-ku, JP;

Shingo Kano, Shinagawa-ku, JP;

Hisashi Maekawahara, Shinagawa-ku, JP;

Naomi Okamura, Shinagawa-ku, JP;

Inventors:

Atsushi Saito, Shinagawa-ku, JP;

Masaki Ito, Shinagawa-ku, JP;

Shingo Kano, Shinagawa-ku, JP;

Hisashi Maekawahara, Shinagawa-ku, JP;

Naomi Okamura, Shinagawa-ku, JP;

Assignee:

Cemedine Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 83/00 (2006.01); C08L 83/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a curable composition including an organic polymer containing a crosslinkable silyl group, an ultraviolet ray absorbing agent having a triazine skeleton and a hindered amine based light stabilizer. The composition exhibits improved weather resistance in a thin layer and thick layer portion. Further, disclosed is a curable composition including an organic polymer containing a crosslinkable silyl group, a (meth)acrylic polymer containing an epoxy group, a divalent tin organic carboxylate and an organic amine compound. The composition exhibits excellent properties. Also, disclosed is a curable composition and sealing material including a reactive organic polymer containing at least one crosslinkable silyl group in one molecule thereof, a reactive organic polymer containing less than one crosslinkable silyl group in one molecule thereof, and thermally expandable hollow spheres. The composition has good physical properties. Also, disclosed is a fire-resistant structure forming method.


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