The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Mar. 23, 2018
Cemedine Co., Ltd., Tokyo, JP;
Mazda Motor Corporation, Hiroshima, JP;
Daisuke Makino, Tokyo, JP;
Atsuhiko Suzuki, Tokyo, JP;
Yusuke Murachi, Tokyo, JP;
Motoyasu Asakawa, Hiroshima, JP;
Katsuya Himuro, Hiroshima, JP;
Kenichi Yamamoto, Hiroshima, JP;
CEMEDINE CO., LTD., Tokyo, JP;
MAZDA MOTOR CORPORATION, Hiroshima, JP;
Abstract
Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.