For the Inventor, By the Inventor

Enter assignee name

Chanhassen, MN, United States of America

The Bergquist Company

USPTO Granted Patents = 34

% Expired Patents = 14.7

EPO Patents = 2

Trademarks = 4

Forward Citations = 842

Loading Chart...

Loading Chart...

22 inventors (with patents filed for the assignee):

Sanjay Misra (13 out of 16 patents)

Radesh Jewram (8 out of 10 patents)

David C DeGree (7 out of 7 patents)

4. Herbert J Fick (5 out of 6 patents)

5. Dallas R Humphrey (4 out of 5 patents)

6. Carl R Bergquist (4 out of 4 patents)

7. Roger A West (4 out of 4 patents)

8. Mary L Randall (3 out of 3 patents)

9. Benjamin Philip Gundale (2 out of 14 patents)

10. William E McIntosh (2 out of 4 patents)

11. G M Fazley Elahee (2 out of 2 patents)

12. Kevin L Hanson (2 out of 2 patents)

13. Steven E Bergerson (2 out of 2 patents)

14. Mark Green (2 out of 2 patents)

15. Bruce H Juenger (2 out of 2 patents)

Core Competencies:

Thermal Interface Materials

Conductive Compounds

Heat Sinks

Flexible Films

Dielectric Mounts

Semiconductor Devices

Morphing Fillers

Thermal Diffusion

Interface Pads

Low Melting Metal

Electrical Insulation

Touch Screen Technology

34 patents: Sort by Forward Citations

1. 8430264 - Method for packaging thermal interface materials (2013-04-30),

2. 8205766 - Method for packaging thermal interface materials (2012-06-26),

3. 8110919 - Thermal interface with non-tacky surface (2012-02-07),

4. 8076773 - Thermal interface with non-tacky surface (2011-12-13),

5. 7760507 - Thermally and electrically conductive interconnect structures (2010-07-20),

6. RE39992 - Morphing fillers and thermal interface materials (2007-12-31),

7. 6984685 - Thermal interface pad utilizing low melting metal with retention matrix (2006-01-10),

8. 6898084 - Thermal diffusion apparatus (2005-05-24),

9. 6797758 - Morphing fillers and thermal interface materials (2004-09-28),

10. 6657297 - Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads (2003-12-02),

11. 6650215 - Finned heat sinks (2003-11-18),

12. 6649325 - Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation (2003-11-18),

13. 6624224 - Method of preparing thermally conductive compounds by liquid metal bridged particle clusters (2003-09-23),

14. 6611256 - Touch screen dielectric separators (2003-08-26),

15. 6559835 - Touch screen superimposed electrode configuration (2003-05-06),

Company Overview

The Bergquist Company, based in Chanhassen, MN, specializes in thermal management solutions and advanced materials for electronic applications. The company develops a range of products including thermal interface materials, adhesives, and encapsulants, catering to industries such as electronics, automotive, and telecommunications. With a focus on innovation, Bergquist enhances the performance and reliability of electronic devices through its expertise in thermal management and material science.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

34 Patents

#4 in Chanhassen, MN

#284 in Minnesota

#10,022 in US

#19,651 in the World

Chanhassen, MN, United States of America

The Bergquist Company

Forward Citations = 842

22 inventors:

Sanjay Misra (13 out of 16 patents)

Radesh Jewram (8 out of 10 patents)

David C DeGree (7 out of 7 patents)

4. Herbert J Fick (5 out of 6 patents)

5. Dallas R Humphrey (4 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: The Bergquist Company. Retrieved from https://idiyas.com/company/bergquist-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…