The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2003
Filed:
May. 25, 2001
Benjamin P. Gundale, St. Louis Park, MN (US);
Sanjay Misra, Shoreview, MN (US);
The Bergquist Company, Chanhassen, MN (US);
Abstract
Methods and formulations for use in preparing thermally conductive dielectric mounts for heat generating semi-conductor devices and associated circuitry. The formulations include a thermoplastic resin selected from the group consisting of polysulfone, poly-ethersulfone, poly-phenylsulfone, and poly-etherimides, with these resins being applied as a dispersion onto the surfaces of opposed metallic members. The dispersion is dried and thereafter treated under heat and pressure at temperatures greater than the glass transition temperature under unit pressures of between 100 psi and 800 psi and for periods in excess of about 30 minutes. The polymer resin may be filled with solid particulate such as alumina and/or boron nitride.