Northfield, MN, United States of America

Herbert J Fick


Average Co-Inventor Count = 1.4

ph-index = 6

Forward Citations = 258(Granted Patents)


Company Filing History:


Years Active: 1976-1989

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6 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Herbert J. Fick

Introduction

Herbert J. Fick is a notable inventor based in Northfield, MN, who has made significant contributions to the field of electronic device thermal management. With a total of six patents to his name, Fick's work focuses on enhancing the efficiency of heat dissipation in solid-state devices. His innovative approaches have paved the way for advancements in electronic component design.

Latest Patents

Fick's latest patents include a groundbreaking method for interfacing heat sinks with electronic devices. This invention promotes the withdrawal and dissipation of heat through a thin broad-area dielectric interface made of dual filled layers of compliant silicone rubber. The design ensures intimate voidless surface contacts and high-quality thermal matching, which are crucial for effective heat transfer. Another notable patent involves a thermally conductive laminate structure that serves as a mounting base for solid-state electronic devices. This laminate comprises multiple layers, including outer metallic layers and center insulative layers filled with particulate solids, enhancing both thermal conductivity and electrical insulation.

Career Highlights

Throughout his career, Fick has worked with prominent companies such as The Bergquist Company and G. T. Schjeldahl Company. His experience in these organizations has allowed him to refine his skills and contribute to the development of innovative thermal management solutions for electronic devices.

Collaborations

Fick has collaborated with talented individuals in the field, including David C. DeGree and Bruce H. Juenger. These partnerships have fostered a creative environment that has led to the successful development of his patented technologies.

Conclusion

Herbert J. Fick's contributions to the field of thermal management in electronic devices are noteworthy. His innovative patents and collaborations have significantly advanced the efficiency of heat dissipation technologies. Fick's work continues to influence the design and functionality of solid-state devices in today's technology landscape.

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