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Agile Power Switch 3d-integration Apsi3d

USPTO Granted Patents = 3

EPO Patents = 4

Forward Citations = 0

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3 inventors (with patents filed for the assignee):

Jacques Pierre Henri Favre (3 out of 3 patents)

Jean-Michel Francis Reynes (3 out of 12 patents)

Raphaël Riva (2 out of 2 patents)

4. Baptiste Louis Jean Trajin (1 out of 1 patent)

5. Paul-Etienne Joseph Vidal (1 out of 1 patent)

6. Renaud André Lacabanne (1 out of 1 patent)

7. Bernard José Charles Du Trieu De Terdonck (1 out of 1 patent)

8. Claudia Cadile (0 patent)

9. Jean-Pierre Bernard Marie Fradin (0 patent)

3 patents: Sort by Forward Citations

1. 10847494 - Method of determining thermal impedance of a sintering layer and a measurement system (2020-11-24),

2. 10714428 - Semiconductor power device and a method of assembling a semiconductor power device (2020-07-14),

3. 10332828 - Semiconductor power device comprising additional tracks and method of manufacturing the semiconductor power device (2019-06-25),

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USPTO Data Jan 1 1976 - Dec 16 2025

3 Patents

#1 in Tarbes

#3,973 in France

Agile Power Switch 3d-integration Apsi3d

Forward Citations = 0

3 inventors:

Jacques Pierre Henri Favre (3 out of 3 patents)

Jean-Michel Francis Reynes (3 out of 12 patents)

Raphaël Riva (2 out of 2 patents)

4. Baptiste Louis Jean Trajin (1 out of 1 patent)

5. Paul-Etienne Joseph Vidal (1 out of 1 patent)

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