The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
May. 08, 2015
Agile Power Switch 3d—integration Apsi3d, Tarbes, FR;
Jean-Michel Francis Reynes, Pompertuzat, FR;
Jacques Pierre Henri Favre, La Baule, FR;
Renaud André Lacabanne, Tarbes, FR;
AGILE POWER SWITCH 3D—INTEGRATION APSI3D, Tarbes, FR;
Abstract
Some embodiments are directed to a semiconductor power device and a method of assembling such a device is provided. The semiconductor power device includes a first substrate, a second substrate and an interconnect structure. The first substrate includes a switching semiconductor element, a first electrically conductive layer(s) and a first receiving element. The second substrate includes a second receiving element and a second electrically conductive layer(s). The interconnect structure provides an electrical connection between the first electrically conductive layer and the second electrically conductive layer. The interconnect structure further includes a plurality of interconnect elements of an electrical conductive material. At least one of the plurality of interconnect elements is an alignment interconnect element. The alignment interconnect element is partially received by the first receiving element and is partially received by the second receiving element for aligning a relative position of the first substrate with respect to the second substrate.