For the Inventor, By the Inventor

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Shanghai, China

Advanced Semiconductor Manufacturing Co. Ltd.

USPTO Granted Patents = 2

Forward Citations = 3

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4 inventors (with patents filed for the assignee):

Yuanjun Xu (1 out of 2 patents)

Yilin Yan (1 out of 1 patent)

Weijia Xue (1 out of 1 patent)

4. Jianhua Liu (1 out of 5 patents)

2 patents: Sort by Forward Citations

1. 10035701 - Composite cavity and forming method thereof (2018-07-31),

2. 9553206 - EEPROM core structure embedded into BCD process and forming method thereof (2017-01-24),

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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#761 in Shanghai

#10,051 in China

Shanghai, China

Advanced Semiconductor Manufacturing Co. Ltd.

Forward Citations = 3

4 inventors:

Yuanjun Xu (1 out of 2 patents)

Yilin Yan (1 out of 1 patent)

Weijia Xue (1 out of 1 patent)

4. Jianhua Liu (1 out of 5 patents)

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