For the Inventor, By the Inventor

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Hillsboro, OR, United States of America

Advanced Inquiry Systems, Inc.

USPTO Granted Patents = 31

Forward Citations = 171

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9 inventors (with patents filed for the assignee):

Morgan T Johnson (29 out of 57 patents)

Aaron Durbin (3 out of 14 patents)

David Keith (2 out of 5 patents)

4. Raymond J Werner (2 out of 5 patents)

5. Jose A Santos (1 out of 3 patents)

6. Jens Ruffler (1 out of 1 patent)

7. Lawrence H Walls (1 out of 1 patent)

8. Peter H Decher (1 out of 2 patents)

9. Kenneth S Whiteman (1 out of 3 patents)

Core Competencies:

Semiconductor Wafer

Wafer Testing

Interconnect Layers

Electrical Conductors

Optical Alignment

Process Characterization

Edge-Extended Translator

Full-Wafer Mechanism

31 patents: Sort by Forward Citations

1. 8889526 - Apparatus for thinning, testing and singulating a semiconductor wafer (2014-11-18),

2. 8872533 - Wafer testing system and associated methods of use and manufacture (2014-10-28),

3. 8779789 - Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods (2014-07-15),

4. 8704544 - Method and apparatus for multi-planar edge-extended wafer translator (2014-04-22),

5. 8697456 - Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon (2014-04-15),

6. 8536062 - Chemical removal of oxide layer from chip pads (2013-09-17),

7. 8476630 - Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon (2013-07-02),

8. 8461024 - Methods and apparatus for thinning, testing and singulating a semiconductor wafer (2013-06-11),

9. 8405414 - Wafer testing systems and associated methods of use and manufacture (2013-03-26),

10. 8362797 - Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween (2013-01-29),

11. 8076216 - Methods and apparatus for thinning, testing and singulating a semiconductor wafer (2011-12-13),

12. 7960986 - Methods and apparatus for multi-modal wafer testing (2011-06-14),

13. 7791174 - Wafer translator having a silicon core isolated from signal paths by a ground plane (2010-09-07),

14. 7786745 - Method and apparatus for single-sided extension of electrical conductors beyond the edges of a substrate (2010-08-31),

15. 7786724 - Methods and apparatus for collecting process characterization data after first failure in a group of tested devices (2010-08-31),

Company Overview

Advanced Inquiry Systems, Inc. is a technology company based in Hillsboro, Oregon, specializing in advanced data analysis and inquiry solutions. The organization focuses on developing innovative software tools that enhance decision-making processes across various sectors. By leveraging cutting-edge technologies, Advanced Inquiry Systems aims to provide businesses with the insights needed to navigate complex data landscapes effectively. Their expertise spans multiple domains, including data analytics, artificial intelligence, and information management.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

31 Patents

#10 in Hillsboro, OR

#116 in Oregon

#10,936 in US

#21,284 in the World

Hillsboro, OR, United States of America

Advanced Inquiry Systems, Inc.

Forward Citations = 171

9 inventors:

Morgan T Johnson (29 out of 57 patents)

Aaron Durbin (3 out of 14 patents)

David Keith (2 out of 5 patents)

4. Raymond J Werner (2 out of 5 patents)

5. Jose A Santos (1 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Advanced Inquiry Systems, Inc.. Retrieved from https://idiyas.com/company/advanced-inquiry-systems

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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