The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Dec. 07, 2016
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Jui-Pin Hung, Hsinchu, TW;
Feng-Cheng Hsu, New Taipei, TW;
Shuo-Mao Chen, New Taipei, TW;
Shin-Puu Jeng, Hsinchu, TW;
De-Dui Marvin Liao, Hsin-Chu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor package structure includes a redistribution layer (RDL), a chip, a plurality of interconnecting bumps and an encapsulant. The redistribution layer has a first surface and a second surface opposite to each other. The chip is disposed over the redistribution layer with a plurality of contact pads facing the first surface and electrically connected to the redistribution layer. The interconnecting bumps are disposed over the first surface and electrically connected to the redistribution layer. The encapsulant is disposed over the first surface of the redistribution layer, and the encapsulant encloses the chip and surrounds lateral walls of the interconnecting bumps.