The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
May. 17, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Tsun-Jen Chan, Taoyuan County, TW;
Cheng-Hung Hu, Hsinchu, TW;
Yi-Hann Chen, Hsinchu, TW;
Kang Hua Chang, Hsinchu, TW;
Ming-Te Chen, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/54 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01); H01L 21/265 (2006.01); H01J 37/317 (2006.01);
U.S. Cl.
CPC ...
C23C 14/54 (2013.01); H01J 37/3171 (2013.01); H01L 21/265 (2013.01); H01L 21/26593 (2013.01); H01L 21/67115 (2013.01); H01L 21/67201 (2013.01); H01L 21/67213 (2013.01); H01L 21/67745 (2013.01); H01J 2237/31701 (2013.01);
Abstract
A system includes an implantation chamber; a warming chamber, wherein the warming chamber is outside of the implantation chamber and has a sidewall shared with the implantation chamber; a first robotic arm configured to move a first wafer from the implantation chamber into the warming chamber; and a second robotic arm configured to move a second wafer into the implantation chamber.