The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Jan. 20, 2016
Applicant:
Air Products and Chemicals, Inc., Allentown, PA (US);
Inventors:
Xiaobo Shi, Chandler, AZ (US);
James Allen Schlueter, Phoenix, AZ (US);
Joseph Rose, Chandler, AZ (US);
Mark Leonard O'Neill, Queen Creek, AZ (US);
Malcolm Grief, Phoenix, AZ (US);
Assignee:
VERSUM MATERIALS US, LLC, Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); C09G 1/02 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); B24B 37/044 (2013.01); C09G 1/02 (2013.01); C09K 3/1463 (2013.01);
Abstract
Copper chemical mechanical polishing (CMP) formulation, method and system are disclosed. The CMP formulation comprises particulate materials, at least two or more amino acids, oxidizer, corrosion inhibitor, and rest being water.