The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Mar. 07, 2016
Applicant:

Lam Research Ag, Villach, AT;

Inventors:

Dietmar Hammer, Treffen, AT;

Reinhold Schwarzenbacher, Reisseck, AT;

Milan Pliska, Villach, AT;

Bridget Hill, Villach, AT;

Michael Brugger, Millstatt, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/10 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); B08B 3/10 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01);
Abstract

An apparatus for treating a wafer-shaped article comprises a spin chuck configured to hold a wafer-shaped article of a predetermined diameter in a position wherein a lower surface of the wafer-shaped article is spaced a predetermined distance from an upper surface of the spin chuck. A treatment assembly is mounted above the upper surface of the spin chuck and underlying a wafer-shaped article when mounted on the spin chuck. The treatment assembly extends parallel to the upper surface from an axis of rotation of the spin chuck radially to a distance that is at least half the predetermined diameter. The spin chuck comprises upwardly projecting gripping pins configured to hold a wafer-shaped article in position, wherein the gripping pins do not pass through the treatment assembly.


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