The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Mar. 20, 2017
Intel Corporation, Santa Clara, CA (US);
Kristof Darmawikarta, Chandler, AZ (US);
Robert Alan May, Chandler, AZ (US);
Yikang Deng, Chandler, AZ (US);
Amruthavalli Pallavi Alur, Tempe, AZ (US);
Sheng Li, Gilbert, AZ (US);
Chong Zhang, Chandler, AZ (US);
Sri Chaitra Jyotsna Chavali, Chandler, AZ (US);
Amanda E. Schuckman, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A metal protected fan-out cavity enables assembly of a package-on-package (PoP) integrated circuit while reducing PoP solder spacing and overall z-height. A horizontal fan-out conductor provides a contact between a die contact and a lower package via. A metal protection layer may be used during manufacture to protect the fan-out conductor, such as providing a laser stop during laser skiving. The metal protection layer materials and an etching solution may be selected to allow for subsequent removal via etching while leaving the fan-out conductor intact. The metal protection layer and fan-out conductor materials may also be selected to reduce or eliminate formation of an intermetallic compound (IMC) between the metal protection layer and the fan-out conductor.