The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Nov. 13, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chi-Wen Chang, Yuanlin Township, TW;
Hui Yu Lee, Hsinchu, TW;
Ya Yun Liu, Jhubei, TW;
Jui-Feng Kuan, Zhubei, TW;
Yi-Kan Cheng, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/455 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5081 (2013.01); G06F 17/5009 (2013.01); G06F 17/5068 (2013.01); G06F 2217/80 (2013.01);
Abstract
A method of making a three-dimensional (3D) integrated circuit (IC) includes performing a series of simulations of operations of a first die of the 3DIC in response to a corresponding series of input vectors and at least one environment temperature. The method also includes adjusting, for at least one simulation in the series of simulations, the at least one environment temperature based on an operational temperature profile of a second die of the 3DIC.